1-20 of 36
Research Paper
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application

Siddharth Bhopte, Musa S. Alshuqairi, Dereje Agonafer, Fellow ASME, Gamal Refai-Ahmed, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 519–523.
https://doi.org/10.1115/1.1827267
Published Online: January 24, 2005
View Article titled, Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application
Open the PDF for Mixed Convection of Impinging Air Cooling Over Heat Sink in Telecom System Application in another window
Topics: Heat sinks, Mixed convection, Reynolds number, Nozzles, Cooling, Computer simulation, Heat, Flow (Dynamics), Rayleigh number
Journal Articles

Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint

Y. C. Chan, M. O. Alam, K. C. Hung, H. Lu, C. Bailey
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 541–545.
https://doi.org/10.1115/1.1756590
Published Online: January 24, 2005
View Article titled, Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint
Open the PDF for Effect of Underfill Entrapment on the Reliability of Flip-Chip Solder Joint in another window
Topics: Bonding, Flip-chip, Flip-chip devices, Flow (Dynamics), Reliability, Solder joints, Solders, Modeling
Journal Articles

An Analytical Study of the Optimized Performance of an Impingement Heat Sink

S. B. Sathe, B. G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 528–534.
https://doi.org/10.1115/1.1827269
Published Online: January 24, 2005
View Article titled, An Analytical Study of the Optimized Performance of an Impingement Heat Sink
Open the PDF for An Analytical Study of the Optimized Performance of an Impingement Heat Sink in another window
Topics: Design, Flow (Dynamics), Heat sinks, Pressure drop, Computation, Heat transfer, Fins
Journal Articles

Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages

K. Ramakrishna, Fellow ASME,, T.-Y. Tom Lee, Mem. ASME,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 449–456.
https://doi.org/10.1115/1.1827260
Published Online: January 24, 2005
View Article titled, Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages
Open the PDF for Evaluation of Thermal Enhancements to Flip-Chip-Plastic Ball Grid Array Packages in another window
Topics: Flat heat pipes, Forced convection, Mixed convection, Natural convection, Printed circuit boards, Thermal conductivity, Thermal resistance, Heat transfer, Copper, Junctions
Journal Articles

Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination

Yoji Kitamura, Masaru Ishizuka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 423–428.
https://doi.org/10.1115/1.1827256
Published Online: January 24, 2005
View Article titled, Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination
Open the PDF for Chimney Effect on Natural Air Cooling of Electronic Equipment Under Inclination in another window
Topics: Cooling, Electronic equipment, Temperature, Natural convection, Flow (Dynamics), Computer simulation
Journal Articles

Thermal Model of a Thinned-Die Cooling System

N. Boiadjieva, P. Koev
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
https://doi.org/10.1115/1.1826079
Published Online: January 24, 2005
View Article titled, Thermal Model of a Thinned-Die Cooling System
Open the PDF for Thermal Model of a Thinned-Die Cooling System in another window
Topics: Air flow, Cooling systems, Flat heat pipes, Flow (Dynamics), Heat exchangers, Temperature, Cooling, Heat, Silicon
Journal Articles

Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs

Tunc Icoz, Yogesh Jaluria
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 465–471.
https://doi.org/10.1115/1.1827262
Published Online: January 24, 2005
View Article titled, Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs
Open the PDF for Design of Cooling Systems for Electronic Equipment Using Both Experimental and Numerical Inputs in another window
Topics: Computer simulation, Cooling systems, Design, Electronic equipment, Flow (Dynamics), Heat, Temperature, Turbulence, Cooling, Heat transfer
Journal Articles

h adiabatic and u max ′

Robert J. Moffat
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 501–509.
https://doi.org/10.1115/1.1827265
Published Online: January 24, 2005
View Article titled, h adiabatic and u max ′
Open the PDF for h adiabatic and u max ′ in another window
Topics: Computational fluid dynamics, Flow (Dynamics), Heat transfer, Temperature, Turbulence, Heat transfer coefficients, Heat conduction, Heating, Coolants, Computer cooling
Journal Articles

Methodology for an Integrated (Electrical/Mechanical) Design of PWBA

Wonkee Ahn, Dereje Agonafer, Fellow ASME, Shlomo Novotny, Fellow ASME
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 524–527.
https://doi.org/10.1115/1.1827268
Published Online: January 24, 2005
View Article titled, Methodology for an Integrated (Electrical/Mechanical) Design of PWBA
Open the PDF for Methodology for an Integrated (Electrical/Mechanical) Design of PWBA in another window
Topics: Design, Mechanical computer-aided design, Printed circuit boards, Manufacturing
Journal Articles

Optimal Design for PPF Heat Sinks in Electronics Cooling Applications

Han-Ting Chen, Jenn-Tsong Horng, Po-Li Chen, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 410–422.
https://doi.org/10.1115/1.1826078
Published Online: January 24, 2005
View Article titled, Optimal Design for PPF Heat Sinks in Electronics Cooling Applications
Open the PDF for Optimal Design for PPF Heat Sinks in Electronics Cooling Applications in another window
Topics: Design, Heat sinks, Optimization
Journal Articles

Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)

M. Herna´ndez-Mora, J. E. Gonza´lez, M. Ve´lez-Reyes, J. M. Ortiz-Rodrı´guez, Y. Pang, E. Scott
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 477–490.
https://doi.org/10.1115/1.1827264
Published Online: January 24, 2005
View Article titled, Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM)
Open the PDF for Dynamic Reduced Electrothermal Model for Integrated Power Electronics Modules (IPEM) in another window
Topics: Capacitance, Electronics, Heat transfer, Simulation, Temperature, Thermal analysis, Transients (Dynamics), Computer software, Heat, Design
Journal Articles

Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power

C. P. Tso, K. W. Tou, H. Bhowmik
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 546–553.
https://doi.org/10.1115/1.1827270
Published Online: January 24, 2005
View Article titled, Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power
Open the PDF for Experimental and Numerical Thermal Transient Behavior of Chips in a Liquid Channel During Loss of Pumping Power in another window
Topics: Natural convection, Steady state, Transients (Dynamics), Heat, Temperature, Flow (Dynamics), Coolants, Water, Heat transfer, Pumps
Journal Articles

Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment

Gamal Refai-Ahmed, Fellow ASME, Stephanie Trottier
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 535–540.
https://doi.org/10.1115/1.1773199
Published Online: January 24, 2005
View Article titled, Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment
Open the PDF for Thermal Performance of Next Generation of Modulated Pump Lasers in Telco Equipment in another window
Topics: Cycles, Lasers, Pumps, Temperature, Thermal resistance
Journal Articles

Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication

Victor Adrian Chiriac, Tien-Yu Tom Lee, Vern Hause
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 429–434.
https://doi.org/10.1115/1.1827257
Published Online: January 24, 2005
View Article titled, Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication
Open the PDF for Thermal Performance Optimization of Radio Frequency Packages for Wireless Communication in another window
Topics: Heat, Junctions, Optimization, Solders, Temperature, Thermal conductivity, Thermal resistance, Epoxy adhesives, Epoxy resins, Numerical analysis
Journal Articles

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Brian H. Dennis, Zhen-xue Han, George S. Dulikravich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 457–464.
https://doi.org/10.1115/1.1827261
Published Online: January 24, 2005
View Article titled, Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components
Open the PDF for Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components in another window
Topics: Ball-Grid-Array packaging, Boundary-value problems, Errors, Flux (Metallurgy), Heat, Heat conduction, Temperature, Temperature distribution, Finite element analysis, Finite element methods
Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 472–476.
https://doi.org/10.1115/1.1827263
Published Online: January 24, 2005
View Article titled, Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices
Open the PDF for Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices in another window
Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)
Journal Articles

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

Yasin Makwana, Dereje Agonafer, Fellow ASME, Dan Manole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
https://doi.org/10.1115/1.1827272
Published Online: January 24, 2005
View Article titled, Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System
Open the PDF for Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System in another window
Topics: Compressors, Refrigeration, Temperature, Stress, Computers, Stability, Vapors, Valves
Journal Articles

A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model

Wataru Nakayama, Ryuichi Matsuki, Yukari Hacho, Kiyoko Yajima
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 440–448.
https://doi.org/10.1115/1.1827259
Published Online: January 24, 2005
View Article titled, A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model
Open the PDF for A New Role of CFD Simulation in Thermal Design of Compact Electronic Equipment: Application of the Build-up Approach to Thermal Analysis of a Benchmark Model in another window
Topics: Computational fluid dynamics, Design, Electronic equipment, Simulation, Thermal analysis, Taguchi methods, Temperature, Thermal resistance
Journal Articles

Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

Roger Schmidt, Ethan Cruz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 510–518.
https://doi.org/10.1115/1.1827266
Published Online: January 24, 2005
View Article titled, Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures
Open the PDF for Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures in another window
Topics: Data centers, Flow (Dynamics), Temperature, Tiles, Computers
Journal Articles

The Challenges of Electronic Cooling: Past, Current and Future

Richard C. Chu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 491–500.
https://doi.org/10.1115/1.1839594
Published Online: January 24, 2005
View Article titled, The Challenges of Electronic Cooling: Past, Current and Future
Open the PDF for The Challenges of Electronic Cooling: Past, Current and Future in another window
Topics: Cooling