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Keywords: Optimal Thermal Design
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 410–422.
Published Online: January 24, 2005
.... 10 January 2004 08 May 2004 24 01 2005 heat sinks thermal management (packaging) product design thermal analysis Taguchi methods quadratic programming response surface methodology thermal resistance Optimal Thermal Design PPF Heat Sink DOE CCD RSM SQP Thermal...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 397–406.
Published Online: December 21, 2004
... thermal resistance gradient methods sensitivity analysis optimisation optimal thermal design pin-fin heat sink DOE CCD RSM thermal resistance pressure loss mass constraint In recent years, the heat sink has become the most common thermal management hardware in use...
