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Keywords: Pressure Loss
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 410–422.
Published Online: January 24, 2005
... Resistance Pressure Loss In recent years, heat sink is the most common thermal management hardware in use in the electronics industry. The heat sink can be defined as a heat dissipater that operates as a result of the temperature difference and thermal resistances between the electronic package...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 397–406.
Published Online: December 21, 2004
... thermal resistance gradient methods sensitivity analysis optimisation optimal thermal design pin-fin heat sink DOE CCD RSM thermal resistance pressure loss mass constraint In recent years, the heat sink has become the most common thermal management hardware in use...