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Keywords: Young's modulus
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031005.
Paper No: EP-13-1135
Published Online: September 1, 2015
.... Fig. 8 AFM image for nanoindentation over IMCs Table 6 Mechanical properties for IMCs IMCs Young's modulus (GPa) Hardness (GPa) Ag 3 Sn 74 ± 3 3.32 ± 0.2 Cu 6 Sn 5 91 ± 5 5.8 ± 0.6 A detailed study was carried out to explore the individual phase...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020901.
Published Online: June 7, 2011
... loading on mechanical properties of Al–Cu and Cr–Cu interfaces. The mechanical properties are investigated by MD simulations of nanoindentation. Both the results of MD simulations and experiments show the Young’s modulus decrease after thermal cycling, and the Cr–Cu interface is more sensitive...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041012.
Published Online: December 8, 2010
...). The coefficient of thermal expansion, glass transition temperature ( T g ), Young’s modulus (E), and fracture toughness were revealed by using a thermal mechanical analyzer, a dynamic mechanical analyzer, and a single-edge notch three-point bending test, while moisture absorption study was performed using an 85...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. December 2004, 126(4): 560–564.
Published Online: January 24, 2005
... of underfills were manipulated to represent extremes of practical underfills. The steady-state creep model was incorporated for the eutectic solder bump to represent its real behavior. It was found from the parametric studies that the underfill with high Young’s modulus, low coefficient of thermal expansion...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
Published Online: July 8, 2004
.... Associate Editor: G.-Q. Lu. 01 July 2003 08 07 2004 packaging design for environment environmental degradation dielectric losses Young's modulus bending thermal expansion finite element analysis permittivity reliability The LCP has very attractive properties that include...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 265–270.
Published Online: July 8, 2004
... warpage are Young’s modulus, thickness, and coefficient of thermal expansion (CTE). In this paper, an experimental design and statistical methods were used to identify the model structure and parameters that are critical to the warpage of wafers. Bilinear regression models were identified based...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 59–66.
Published Online: March 14, 2003
..., 63Sn-37Pb, and 62Sn-36Pb-2Ag solders at the strain rates of 0.001–10.0%/s between temperatures of 313 K and 398 K. Strain rates faster than 2.0%/s were needed to obtain the time-independent Young modulus and yield stress of the solders. Tensile strength increased with increasing strain rates up to 10...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2000, 122(3): 214–219.
Published Online: January 17, 2000
... of the solder interconnects. The material properties and geometry parameters that have been investigated are the Young’s modulus, the coefficient of thermal expansion (CTE) of the underfill, the out-of-plane CTE CTE z of the substrate, the thickness of the substrate, and the standoff height. When...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 47–51.
Published Online: September 2, 1998
... circuit reliability filled polymers diffusion moisture moulding sorption plasticity Young's modulus tensile strength bending strength Moisture sorption in molding compounds employed in plastic packaging of integrated circuit (IC) devices has been treated by the majority of investigators...