... modeling, that address the nature of the singular solutions at the crack tip and provide insight when dealing with the more complex problem of solder joint fracture. Using three-dimensional finite element analysis of a chip scale package, we systematically examine the stress-strain behavior at the edge...

...Jose Omar S. Amistoso; Alberto V. Amorsolo, Jr. Cold bump pull tests performed on wafer level chip scale packages using SAC105 solder bumps show an increase in the occurrence of brittle failure modes with aging temperature and time. Fast intermetallic growth at 0–1000 h can be attributed to ( Cu...

... a 10,000 g shock of any duration in any direction without exceeding the Cirlex tensile stress of 229 MPa. 31 07 2008 03 06 2009 21 10 2009 atomic clocks chip scale packaging clocks displacement measurement finite element analysis surface emitting lasers temperature control...

... is Key to Productivity and Profitability ,” SMT Magazine , January , pp. 40 – 42 . 13 01 2008 05 11 2008 01 04 2009 ball grid arrays chip scale packaging plastic packaging Over the past several decades, electronic packaging technology has been evolving rapidly...

...Jin Yang; I. Charles Ume Microelectronics packaging technology has evolved from through-hole and bulk configurations to surface-mount and small-profile configurations. Surface mount devices, such as flip chip packages, chip scale packages, and ball grid arrays, use solder bump interconnections...

... simulations support the experimental results. A reliability estimate for capacitor integrity under given loading conditions is given. 06 11 2007 26 09 2008 13 02 2009 capacitance measurement ceramic capacitors chip scale packaging crack detection failure analysis finite element...

... parameters. As a result, the verified models can be used to determine the location of the critical solder joint and to obtain estimates of the solder lifetime performance. 27 12 2007 07 08 2008 12 02 2009 chip scale packaging finite element analysis high-speed techniques image...

... with fatigue reliability of a thin-profile fine-pitch ball grid array chip-scale package subjected to power cycling. The numerical model was calibrated using steady-state and power cycling experiments. Following the calibrated numerical model, different power cycling durations on the thermal characteristics...

... through experimentation and finite element analysis. 20 02 2007 03 10 2007 15 05 2008 atomic clocks bimetals chip scale packaging discs (structures) heat conduction switches temperature control thermal management (packaging) The goal of the DARPA chip scale atomic...

.... As predicted by the model, significant reduction in wiresweep is achieved. Thus, the compression mold process seems to offer the opportunity for reducing wiresweep without any compromise in the complexity of the die stack. References Intel® Stacked Chip Scale Packaging Products, Product Overview, last...

...Wen-Ren Jong; Hsin-Chun Tsai; Hsiu-Tao Chang; Shu-Hui Peng In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies...

.... The measured constitutive behavior has been incorporated into nonlinear finite element simulations. Predictive models have been developed for the dominant failure mechanisms for all the component architectures tested. 29 12 2004 07 03 2007 automotive electronics ball grid arrays chip scale...

...Yi-Shao Lai; Chang-Lin Yeh; Ching-Chun Wang We present in this paper parametric studies of board-level reliability of wafer-level chip-scale packages subjected to a specific pulse-controlled drop test condition. Eighteen experiment cells, constructed by varying joint pitch, die thickness, and die...

... such as ball grid array (BGA) and chip-scale package (CSP) assemblies are being used in double-sided configurations for network and memory device applications as they reduce the routing space and improve electrical performance ( Shiah, A. C., and Zhou, X., 2002, “A Low Cost Reliability Assessment for Double...

...Tong Hong Wang; Chang-Chi Lee; Yi-Shao Lai; Yu-Cheng Lin In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient thermal analysis. Tabular boundary conditions...

... extensively in high-density electronics such as (PDA), mobile phone, (LCD), smart cards, and disk drives 2 . ACF Bumpless Reflow Reliability silicon conducting polymers polymer films aluminium chip scale packaging integrated circuit bonding reflow soldering adhesives adhesive...

... possible configurations for the solution presented. 29 07 2004 18 05 2005 heat sinks thermal management (packaging) chip scale packaging heat conduction thermal conductivity microprocessor chips Thermal management of electronic packages and systems is one of the key technical...

... solutions based on a duromer MID approach. Manuscript received January 6, 2004; revision received June 24, 2004. Review conducted by: Y. C. Chan. 06 January 2004 24 June 2004 21 03 2005 chip scale packaging encapsulation integrated circuit interconnections integrated circuit...

... with tensile strength up to 71 MPa. The potential application of BCB bonding is demonstrated on a concept of wafer-level chip-scale package for RF applications and microfilter array for microfluidic applications. Manuscript received January 6, 2004; revision received June 8, 2004. Review conducted by: Y...

... packaging adhesives chip scale packaging adhesive bonding encapsulation integrated circuit reliability chip-on-board packaging Many simple processes for flip chip assemblies at low costs have been developed 1 2 3 4 5 . There are many options to select from for a particular application...