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Keywords: drag
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 139–143.
Published Online: March 14, 2003
... in this study to calculate the deformation of the wire. For C-MOLD Microchip Encapsulation Solution, ABAQUS had been chosen as the structure analyzer to calculate the deformation of the wire. For InPack, ANSYS is used to calculate the deformation of the wire. Effect of Wire Density. The drag force...
