...Hironori Tohmyoh; Kiichiro Yamanobe; Masumi Saka; Jiro Utsunomiya; Takeshi Nakamura; Yoshikatsu Nakano This paper deals with typical mechanical problems that are encountered in a solderless press-fit assembly process. First, the elastic-plastic properties of two types of press-fit pins...

...H. R. Ghorbani; J. K. Spelt A two-dimensional model has been developed for the interfacial thermal stresses in short and long trilayer assemblies under both plane stress and plane strain conditions. Interfacial stresses are approximated using a combination of exact elasticity solutions...

...Ji Hyuck Yang; Kang Yong Lee The purposes of the paper are to consider the failure phenomenon by delamination and crack when the encapsulant of plastic IC package under hygrothermal loading in the IR soldering process shows elastic and viscoelastic behaviors and to suggest the optimum design...