... of using the full-field measurement technique used in this study. 06 02 2007 11 01 2008 17 11 2008 accelerometers electronic engineering computing impact (mechanical) printed circuit testing printed circuits strain gauges transient response With the ever-growing market...

... of N f versus γ . Here, it can be seen that higher values of γ tend to yield a longer life. 05 09 2006 13 11 2006 electronic engineering computing electronics packaging plasticity Development of the disturbed state...

... circuits integrated circuit packaging integrated circuit design thermal analysis circuit optimisation electronic engineering computing Integrated Design Optimization Integrated Power Electronic Module Thermal Analysis While thermal management is a key enabling technology for the next...

... collisions and improper ram speed. If the deformation of wire is too large, it can cause a short circuit (due to touching of adjacent wires) or open circuit (due to wire breakage). integrated circuit packaging encapsulation drag moulding wires (electric) electronic engineering computing...

... October 2001 14 03 2003 ball grid arrays chip scale packaging circuit reliability stress analysis finite element analysis eigenvalues and eigenfunctions electronic engineering computing In order to meet the challenges of further miniaturization in electronic device packaging...