... to that of the slot jet, especially in terms of high-flux heat dissipation. Unprecedented cooling fluxes, as high as 1127 W / cm 2 , are achieved with the circular jets without incurring CHF. 01 07 2008 08 01 2009 21 04 2009 cooling flow simulation jets microchannel flow thermal management...

... characteristics, and near field optical patterns for unidirectional and direct de-ionized water-cooling, are used to show the validity of the technique. Modeling of fluid flow is conducted to investigate the effect of flowing water over the laser package. biological organs cancer cooling dosimetry flow...

... for macroscale channels, can also be used to enhance heat transfer inside microchannels. laminar flow microchannel flow flow simulation heat transfer dimple microchannel heat transfer enhancement Heat transfer inside flow passages can be enhanced by using passive surface modifications...

.... Manuscript received June 29, 2003; revision received June 27, 2004. Review conducted by: B. Sammakia. 29 June 2003 27 June 2004 21 03 2005 integrated circuit packaging thermal management (packaging) surface mount technology flow simulation computational fluid dynamics shear...

... by: B. Sammakia. 21 May 2004 19 July 2004 24 01 2005 heat sinks electronics packaging plates (structures) cooling convection jets nozzles flow simulation finite volume methods telecommunication Lee , D. Y. , and Vafai , K. , 1999 , “ Comparative...

... and reduce the velocity. heat sinks multichip modules heat transfer thermal analysis flow simulation jets optimisation numerical analysis 11 June 2004 10 August 2004 24 01 2005 Manuscript received June 11, 2004; revision received August 10, 2004. Review conducted...

... ventilation natural convection numerical analysis flow simulation The power dissipation density of electronic equipment has increased in recent years and, as a result, it is necessary to consider the cooling design of electronic equipment in order to develop suitable cooling techniques...

... 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat transfer temperature control rods (structures) flow simulation IC Cooling Heat Spreader Mathematical Thermal Model 1D Non-Uniform Rod Once a first silicon device is fabricated, “real...

.... Since, for laminar flows, simulations are quite accurate and enable any changes in geometry and material properties to be done in seconds by changing the input parameters, they are advantageous over experiments and can be used very efficiently. 10 Experimentally measured variation of array...

... packaging product development thermal analysis singular value decomposition Taguchi methods flow simulation product design computational geometry In various classes of electronic equipment the packaging density in the system box is rapidly rising. This is most visible in portable electronic...

... May 2004 05 October 2004 24 01 2005 electronics packaging HVAC heat transfer computational fluid dynamics compressible flow flow simulation turbulence numerical analysis Heat loads of data processing equipment continue to increase at a rapid rate. This increasing heat...

... 2004. Associate Editor: W. King. 01 August 2003 01 April 2004 06 10 2004 microprocessor chips thermal resistance integrated circuit packaging flip-chip devices thermal stresses temperature distribution cooling flow simulation In the past decade, simulation...

... permeability flow simulation aluminium temperature distribution The trend in electronics industry toward smaller and more powerful products has increased power density of electronic components, as shown in Fig. 1 . For reliable operation of these products, thermal modeling and design of electronic...

... the proposed model is applicable for any geometric arrangement of solder bumps, rectangular-array of solder bumps layout was used first for comparison with experimental results of other article. Comparisons of the flow-front shapes and filling time with the experimental data indicated that the flow simulation...

... computational fluid dynamics thermal management (packaging) pressure flow simulation pipe flow The trend in modern electronic systems design is to increase the speed and power of processing while at the same time reducing the size and weight of the electronic device 1 . The electronic systems can...

... and Photonic Packaging Division of THE AMERICAN SOCIETY OF MECHANICAL ENGINEERS . Manuscript received by the EPPD October 5, 1999. Associate Editor: R. Wirtz. 05 October 1999 heat sinks flow simulation computational fluid dynamics heat transfer finite element analysis With advances...

... . For the flow simulation, some material properties were measured. These include viscosity, curing kinetics, heat capacity, thermal conductivity, and density as a function of temperature, pressure, and degree of cure ( pvT α relation). The epoxy-molding compound used in the experiment...