... cooling boundary layer turbulence forced convection thermal management (packaging) infrared imaging temperature measurement microfluidics Thermal management of tight space, low power electronics applications is one of the current challenging engineering problems. More functionality, faster...

... multichip modules natural convection finite element analysis infrared imaging heat conduction heat transfer The validity of the proposed FE modeling (i.e., DFEA) is assessed through the TTD measurement and the modified IRTTC approach. It involves the validation of both the heat conduction FE...

... electronics packaging infrared imaging temperature distribution flow measurement temperature measurement cooling All successful electronic systems are to some degree packaged in a way that ensures that they run at a low enough temperature to give an acceptable level of reliability. The process...