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Keywords: life prediction
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2020, 142(2): 021003.
Paper No: EP-19-1081
Published Online: February 3, 2020
... LED chip scale package silicone titanium modification high temperature stability life prediction Light-emitting diode (LED) is widely used in many fields such as automobiles, indoor and outdoor lighting, displays, and mobile phones [ 1 , 2 ]. With the continuous improvement of quality life...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011013.
Paper No: EP-19-1068
Published Online: November 14, 2019
... into the fitting constants in the life prediction models [ 27 – 30 ]. To overcome the shortage that the thermal fatigue prediction is always dependent on the shapes, dimensions of the microelectronic chip and the thermomechanical properties of the solder, the purpose of this study is to develop an objective...
Journal Articles
Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
Published Online: June 23, 2011
... imaging thermal fatigue life prediction crack propagation phase growth solder joints flip chip, nondestructive inspection x-ray microtomography synchrotron radiation. In electronic devices and components, one issue of particular importance is the electrical and mechanical reliability...