... accuracy at a relatively low cost. laser ultrasound flip chip solder bump local temporal coherence lead-free laser vibrometer chip scale packaging electronics packaging flip-chip devices laser beam applications light interferometry solders thermoelasticity ultrasonic applications...

... integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical treatment power cycling accelerated thermal cycling Moiré interferometry flip chip PBGA CBGA finite element analysis computational fluid dynamics...

... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...

... received November 15, 2004. Review conducted by: Y. C. Chan. Packaging. 01 October 2003 06 January 2004 15 November 2004 03 06 2005 chip-on-board packaging integrated circuit packaging light interferometry integrated circuit testing integrated circuit reliability...

... high-speed DRAM application such as direct RDRAM 1 2 . chip scale packaging creep shear deformation anelastic relaxation moire fringes light interferometry soldering finite element analysis 30 May 2002 10 06 2003 Contributed by the Electronic and Photonic Packaging...

.... 03 December 2001 14 03 2003 flip-chip devices reflow soldering inspection quality control light interferometry ultrasonic applications spectral analysis data acquisition time-domain analysis signal processing Consumer demands are driving the current trend...

... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 internal stresses laminates light interferometry moire fringes nondestructive testing stress analysis The subject of residual stress due to coefficient...

... devices ball grid arrays chip scale packaging soldering inspection modal analysis finite element analysis vibration measurement light interferometry photoacoustic effect measurement by laser beam Solder bump technology has been proven to be a reliable interconnection method in many...

... 15 May 2000 plastic packaging flip-chip devices micromechanics circuit reliability shear deformation thermal stresses light interferometry Surface Laminar Circuit Flip Chip Underfill Microscopic Moire´ Interferometry Photosensitive Dielectric Layer Solder Resist Mask Metal...

... surfaces light interferometry surface topography measurement thermal stresses environmental testing Microelectronics devices are comprised of various metal conductors separated by insulating materials. As a result of a mismatch of coefficient of thermal expansion (CTE), the devices warp...

... for Mechanics and Materials ), Springer-Verlag. plastic packaging integrated circuit packaging integrated circuit reliability surface mount technology internal stresses ball grid arrays displacement measurement calibration finite element analysis light interferometry stress measurement...