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Keywords: lumped parameter network
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Journal Articles
Sebastien Sequeira, Kevin Bennion, J. Emily Cousineau, Sreekant Narumanchi, Gilbert Moreno, Satish Kumar, Yogendra Joshi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021114.
Paper No: EP-21-1052
Published Online: February 7, 2022
... to be the liner-to-lamination contact resistance. This work is in part a work of the U.S. Government. ASME disclaims all interest in the U.S. Government' contributions. 31 03 2021 21 11 2021 07 02 2022 electric motor thermal management lumped parameter network FEA sensitivity...
