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Journal Articles

On Failure Mechanisms in Flip Chip Assembly—Part 1: Short-Time Scale Wave Motion

Yoonchan Oh, C. Steve Suh, Hung-Jue Sue
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021008.
DOI: https://doi.org/10.1115/1.2912188
Published Online: May 9, 2008
... S 12 ∕ d t (bottom) waves at Location 1 21 02 2007 26 09 2007 09 05 2008 failure analysis flip-chip devices matrix algebra thermal expansion thermal stresses time-frequency analysis A successful solution to meeting the demand for high inputs...
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Topics: Damage, Failure, Failure mechanisms, Flip-chip devices, High cycle fatigue, Power density, Solders, Stress, Thermal expansion, Wave motion