... is mechanically isolated from the chamber. With this arrangement, moire´ fringes can be recorded while the chamber is being operated. Further details of the rod assembly and the temperature control can be found in Ref. 23 . When deformation measurements are required during an accelerated thermal cycling...

... that the creep behavior of solder reduces the warpage of package and increase the shear deformation of solder bumps. 7 Vertical displacement along the centerline of the chip In this case, the specimen grating was replicated at room temperature (25°C) and all of the moire´ fringes were recorded...

... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 internal stresses laminates light interferometry moire fringes nondestructive testing stress analysis The subject of residual stress due to coefficient...

... 29 December 1999 stainless steel substrates multichip modules moire fringes Stainless steel offers numerous advantages over traditional electronic materials due to its superior strength-to-weight ratio, flexibility, corrosion resistance, impact strength, thickness, thermal...

... design engineering neural nets fatigue moire fringes 29 July 1998 09 December 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING .  Manuscript received by the EEPD July 29, 1998; revision received December 9...