... a small heat sink which is barely capable of dissipating heat for 60 W equivalent LED bulbs with natural convection for today's LED efficacies. 75 W and 100 W equivalent bulbs require larger sizes, some method of forced cooling, or some unusual liquid cooling system; generally none of these approaches...

... , pp. 439 – 444 . 10.1115/1.3689135 [4] Harahap , F. , and McManus , H. N. , 1967 , “ Natural Convection Heat Transfer From Horizontal Rectangular Fin Arrays ,” ASME J. Heat Transfer , 89 , pp. 32 – 38 . 10.1115/1.3614318 [5] Jones , C. D. , and Smith , L. F. , 1970...

... natural convection between the heated electronic components mounted on the left and right vertical walls with a relatively lower temperature. The results of a CFD simulation are used to train and validate a series of ANN architectures, which are developed to quickly and accurately carry out this analysis...

... model for the SFP is constructed and calibrated using a natural convection experiment. The calibrated detailed model is used for generating the limited boundary-condition-independent compact thermal model (CTM). Limited boundary-condition-independence, in this case, refers only to a small subset of all...

...G. De Mey; M. Wójcik; J. Pilarski; M. Lasota; J. Banaszczyk; B. Vermeersch; A. Napieralski; M. De Paepe The thermal impedance Z th ( j ω ) has been measured for the junction of a transistor mounted on a cooling fin. The setup was put inside a chimney in order to enhance the natural convection...

..., such as the manufacturing cost and the design freedom. More importantly, this study has provided a further step in the direction of demonstrating the opening effect. computational fluid dynamics cooling natural convection substrates CFD experimental opening concept thermal solution Electronic cooling...

...Ta-Wei Lin; Ming-Chang Wu; Cheng-Hsien Peng; Po-Li Chen; Ying-Huei Hung Thermal characteristics for a horizontal heated chip mounted with three types of nominally flat silicon-based heat spreaders have been systematically investigated. They include the natural convective and radiative heat transfer...

...Peter M. Teertstra; M. Michael Yovanovich; J. Richard Culham An analytical model is developed for natural convection from a single circuit board in a sealed electronic equipment enclosure. The circuit card is modeled as a vertical isothermal plate located at the center of an isothermal, cuboid...

... , by 6% in natural convection and by 25% in forced convection. (v) An overmolded die with a heat spreader provides better a thermal enhancement than a heat spreader on a bare die for freestream velocities up to about 1 m/s. Beyond 1 m/s, a heat spreader on bare die has better thermal performance...

... of the fan present serious concerns as the air velocity is increased to enhance the cooling capacity. Thus, the interest in natural-convection air cooling is growing to take advantage of low noise and energy savings inherent in that cooling mode. One method of promoting the capacity of natural air cooling...

... range of laminar regimes with the Reynolds number, based on heat source length, from 800 to 2625. The effect of heat fluxes, coolant flow rates, and geometric parameters (such as chip configuration number) are investigated. The operation is extended to study the transient natural convection during...

... that is instrumented with a thermocouple. The case-to-ambient thermal resistance under natural convection with the heat sink is 3.15 ° C ∕ W . Forced convection with the synthetic jets enables a power dissipation of 59.2 W at a case temperature of 70 ° C , resulting in a case-to-ambient thermal resistance of 0.76 ° C...

...Wen-Hwa Chen, ASME Fellow, Professor; Hsien-Chie Cheng, ASME Member, Associate Professor; Chih-Han Lin, Graduate Student The study explores the thermal performance of three-dimensional (3-D), vertically stacked multi-chip modules (the so-called MCM-V) in natural convection through finite element...

... natural convection channel flow laminar flow water In the thermal management of high-power electronic chips, liquid cooling has been considered to replace air cooling as increasing power density makes it difficult to maintain reasonable chip wall temperatures to below 85 ° C . Although...

... captured. 21 01 2003 26 06 2004 printed circuits printed circuit manufacture thermal management (packaging) natural convection ball grid arrays printed circuit testing surface mount technology With ever-reducing product development cycle times preventing extensive...

...Randy D. Weinstein; Amy S. Fleischer; Kimberly A. Krug Natural convection and passive heat rejection from two independent heat sources maintained at different temperatures ( 60 ° C and 100 ° C above ambient) on single circuit boards (FR4 and copper clad FR4) are experimentally studied. The effect...

... 2001 10 06 2003 natural convection heat sinks thermal management (packaging) thermal analysis optimisation specific heat integrated circuit packaging laminar flow Heat Sink Rectangular Plate-Fin Natural Convection Least-Material Optimization The exponential increase...

.... The optimal aspect ratio for ducts with forced and natural convection corresponds to the special geometry and flow conditions where boundary layers meet just as the coolant exits the channel. This “constructal” design principle is illustrated by several classes of examples: laminar forced and natural...

... is investigated in a control volume context with a collocated grid arrangement. The accuracy of the results obtained by both excluding and including the buoyancy term is evaluated through application to the natural convection heat transfer problem in a cavity at different Rayleigh numbers. In addition to many...

..., the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were...