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Keywords: pressure
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 452–459.
Published Online: March 26, 2007
...Milan Visaria; Issam Mudawar This study provides a new systematic approach to predicting the effects of spray inclination on critical heat flux (CHF). Experiments were performed with three pressure spray nozzles over a broad range of inclination angles at five flow rates and subcoolings of 15 ° C...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 247–255.
Published Online: December 13, 2006
... hard to implement because of its very high pressure head required to pump the coolant fluid through the channels. A normal channel size could not give high heat flux, although the pressure drop is very small. A minichannel can be used in a heat sink with quite a high heat flux and a mild pressure loss...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 319–323.
Published Online: June 1, 2006
... and a given temperature, the thermal contact conductance increased with increasing contact pressure. However, a pressure above 0.30 MPa resulted in no significant increase in the conductance. The conductance increased with BN content up to 6.2 vol. % , but decreased upon further increase to 8.6 vol...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 319–324.
Published Online: September 17, 2003
...C. B. Coetzer; J. A. Visser This paper introduces a compact model to predict the interfin velocity and the resulting pressure drop across a longitudinal fin heat sink with tip bypass. The compact model is based on results obtained from a comprehensive study into the behavior of both laminar...