... No. 2004-448. Manuscript received April 27, 2004; revision received May 31, 2004. Review conducted by: B. Sammakia. 27 April 2004 31 May 2004 24 01 2005 electronics packaging cooling product design convection turbulence flow simulation finite volume methods...

... is presented that yields an estimate of the heat transfer coefficient good enough for preliminary design estimates and often as accurate as can be relied on from CFD calculations using present codes. electronics packaging heat transfer turbulence thermal analysis product design cooling computational...

.... 10 January 2004 08 May 2004 24 01 2005 heat sinks thermal management (packaging) product design thermal analysis Taguchi methods quadratic programming response surface methodology thermal resistance Optimal Thermal Design PPF Heat Sink DOE CCD RSM SQP Thermal...

... packaging product development thermal analysis singular value decomposition Taguchi methods flow simulation product design computational geometry In various classes of electronic equipment the packaging density in the system box is rapidly rising. This is most visible in portable electronic...

... by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2002. Associate Editor: A. Y-H. Hung. 01 February 2002 30 04 2004 thermal energy storage finite volume methods product design correlation methods...