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... semiconductor device packaging silicon stress effects residual stress piezoresistive gauge nMOSFET DC characteristics electron-mobility A semiconductor device is sometimes subjected to high residual stress during the packaging (resin-molding) process. This is due to the large mismatch...

... , Prentice-Hall , Upper Saddle River, NJ . 16 10 2008 03 04 2009 14 07 2009 cooling finite element analysis heat pipes heat sinks semiconductor device packaging heat transfer heat flux centrifugal fan circular stacked heat sink finite element analysis embedded heat...

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... semiconductor device packaging stress analysis When polymers used in a semiconductor package absorb moisture, a hygroscopic swelling mismatch between polymers and inorganic materials (silicon, lead frame, etc.) occurs since the latter does not absorb moisture. This mismatch causes hygroscopic stresses...

... nanoelectronics transistors semiconductor device packaging ballistic transport thermal analysis The technological revolution that started with the introduction of the transistor just over half a century ago is without parallel in the way it has shaped our economy and our daily lives. The current trend...

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...) at a power dissipation level of 12.5 W , which is equivalent to a steady-state current conduction of 25 A . 13 06 2005 15 08 2005 power MOSFET modules semiconductor device packaging cryogenic electronics cooling Recently, extensive research has been focused...

... that is positioned at the outermost V-groove in the array, cannot be ignored. Manuscript received January 7, 2004; revision received August 13, 2004. Review conducted by: Y. C. Chan. 07 January 2004 13 August 2004 21 03 2005 silicon elemental semiconductors semiconductor device...

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..., the two failure mechanisms can be interrelated, especially when interface cracking is in close proximity to the solder connections. solders cracks semiconductor device packaging viscoplasticity plastic deformation fracture internal stresses 01 March 2003 01 November 2003 30...

... and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division, December 4, 2001. Associate Editor: B. Courtois. 04 December 2001 17 09 2003 ceramic insulation ceramic packaging semiconductor lasers semiconductor device...

... OF ELECTRONIC PACKAGING . Manuscript received by the EPPD Division June 22, 2001. Guest Editors: Y. Muzychka and R. Culham. 22 June 2001 10 06 2003 integrated circuit packaging semiconductor device packaging optoelectronic devices thermal stresses thermal expansion integrated circuit...

... manuscript received October 5, 2001. Associate Editor: R. Wirtz. 13 September 2000 05 October 2001 12 12 2002 semiconductor device packaging heat transfer natural convection temperature measurement simulation transients Advances in the packaging of portable electronic...