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Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
... microtomography system, the SP- μ CT has been developed at the Super Photon ring-8 GeV (SPring-8), the largest synchrotron radiation facility in Japan. In this work, the SP- μ CT was first applied to the nondestructive evaluation of thermal fatigue phenomena, namely microstructure evolution (i.e., phase growth...
View Article titled, Application of <span class="search-highlight">Synchrotron</span> <span class="search-highlight">Radiation</span> X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
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Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging