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Keywords: temperature control
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031011.
Paper No: EP-22-1097
Published Online: March 30, 2023
... accuracy. In this paper, a fuzzy two-stage temperature control strategy applied to a satellite-borne three-axis integrated fiber optic gyroscope (TAIFOG) is proposed. And the control rules of the fuzzy two-stage temperature controller are described in detail. A thermodynamic model that can quickly...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
Published Online: September 21, 2011
... the benefits of any data center design and operational strategies seeking to improve efficiency, such as temperature controlled fan algorithms. Using the models previously developed by the authors, this paper extends the analysis to include the electronics within the rack through considering the processor heat...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041005.
Published Online: October 21, 2009
...A. D. Laws; R. Borwick, III; P. Stupar; J. DeNatale; Y. C. Lee The power dissipation for chip-scale atomic clocks (CSAC) is one of the major design considerations. 12 mW of the 30 mW power budget is for temperature control of the vertical-cavity-surface-emitting laser (VCSEL) and the alkali-metal...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031012.
Published Online: August 12, 2008
... increase. With power densities approaching 100 W / cm 2 , the current passive control systems are no longer able to maintain the required temperature tolerance for production testing. This paper describes the design and testing of a temperature control system that combines high performance impingement...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021011.
Published Online: May 15, 2008
... cell, contained in the clock, must be maintained at 70 ± 0.1 ° C even under an ambient temperature variation of − 40 ° C to 50 ° C . A thermal test vehicle has been developed to characterize a sample package with a thermal conduction switch. Three cases are presented for the temperature control...
Journal Articles
Timothy D. Boucher, David M. Auslander, Cullen E. Bash, Clifford C. Federspiel, Chandrakant D. Patel
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 137–144.
Published Online: November 11, 2005
...
temperature control can regulate the hottest inlet temperature to T ref ,
but cannot affect the relative distribution of the rack inlet temperatures
locally. This means that all the other rack inlet temperatures, aside from the
hottest one...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
Published Online: January 24, 2005
... 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat transfer temperature control rods (structures) flow simulation IC Cooling Heat Spreader Mathematical Thermal Model 1D Non-Uniform Rod Once a first silicon device is fabricated, “real...