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Keywords: temperature control
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Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041005.
Published Online: October 21, 2009
...A. D. Laws; R. Borwick, III; P. Stupar; J. DeNatale; Y. C. Lee The power dissipation for chip-scale atomic clocks (CSAC) is one of the major design considerations. 12 mW of the 30 mW power budget is for temperature control of the vertical-cavity-surface-emitting laser (VCSEL) and the alkali-metal...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021011.
Published Online: May 15, 2008
... cell, contained in the clock, must be maintained at 70 ± 0.1 ° C even under an ambient temperature variation of − 40 ° C to 50 ° C . A thermal test vehicle has been developed to characterize a sample package with a thermal conduction switch. Three cases are presented for the temperature control...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 137–144.
Published Online: November 11, 2005
... temperature control can regulate the hottest inlet temperature to T ref , but cannot affect the relative distribution of the rack inlet temperatures locally. This means that all the other rack inlet temperatures, aside from the hottest one...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
Published Online: January 24, 2005
... 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat transfer temperature control rods (structures) flow simulation IC Cooling Heat Spreader Mathematical Thermal Model 1D Non-Uniform Rod Once a first silicon device is fabricated, “real...