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1-3 of 3
Keywords: thermoelectric devices
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041005.
Published Online: December 9, 2011
... for a real down-hole scenario. Vacuum flask that houses the system lies inside a drill pipe. Note the rejection of heat from thermoelectric device to the out-flowing mud, through a conductive path. The drill tool is also driven by the force of the flowing mud. Copper-air heat exchanger comprises...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031002.
Published Online: September 8, 2010
... that gives the maximum localized cooling. For liquid heat transfer coefficient between 5000 and 20 , 000 W m − 2 K − 1 , the optimum is found to be between 10 μ m and 20 μ m . Another advantage of thermoelectric devices is their ability to be combined with other conventional liquid cooling techniques ( 6...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 339–347.
Published Online: November 5, 2006
...Boris Abramzon The present study proposes a unified numerical approach to the problem of optimum design of the thermoelectric devices for cooling electronic components. The standard mathematical model of a single-stage thermoelectric cooler (TEC) with constant material properties is employed...