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Keywords: thermomechanical
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Journal Articles
Effect of Voids on Thermomechanical Durability of Pb-Free BGA Solder Joints: Modeling and Simulation
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
Published Online: September 8, 2006
... of the ball, durability increases. For voids bigger than that, the durability starts to decrease. This study also confirms that as voids are located closer to the damage initiation site and the propagation path, their lifespan decreases. FEA voids lead-free thermomechanical durability 03 02...