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Keywords: wires (electric)
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
Published Online: April 30, 2004
... received Oct. 2003. Associate Editor: B. Michel. 01 Oct 2003 30 04 2004 gold lead bonding wires (electric) indentation crystal microstructure recrystallisation differential scanning calorimetry hardness elastic moduli yield strength yield stress secondary ion mass spectra...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 139–143.
Published Online: March 14, 2003
... collisions and improper ram speed. If the deformation of wire is too large, it can cause a short circuit (due to touching of adjacent wires) or open circuit (due to wire breakage). integrated circuit packaging encapsulation drag moulding wires (electric) electronic engineering computing...
