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Keywords: x-ray microtomography
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Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
... inspection by a synchrotron radiation X-ray microtomography system. Moreover, the fatigue crack propagation process was quantified by repeatedly measuring the crack length on the same cross section taken through the center of the same bump. Figure 11 shows the crack propagation process for a set...
View Article titled, Application of Synchrotron Radiation <span class="search-highlight">X</span>-<span class="search-highlight">Ray</span> <span class="search-highlight">Microtomography</span> to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Open the PDF for Application of Synchrotron Radiation <span class="search-highlight">X</span>-<span class="search-highlight">Ray</span> <span class="search-highlight">Microtomography</span> to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects in another window
Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging