Molecular Dynamics Study of Solid Thin-Film Thermal Conductivity

This study uses the molecular dynamics computational technique to investigate the thermal conductivity of solid thin films in the direction perpendicular to the film plane. In order to establish a benchmark reference, the computations are based on the widely used Lennard-Jones argon model due to its agreement with experimental liquid-phase data, its physically meaningful parameters, and its simple two-body form. Thermal conductivity increases with film thickness, as expected from thin-film experimental data and theoretical predictions. The calculated values are roughly 30 percent higher than anticipated. Varying the boundary conditions, heat flux, and lateral dimensions of the films causes no observable change in the thermal conductivity values. The present study also delineates the conditions necessary for meaningful thermal conductivity calculations and offers recommendations for efficient simulations. This work shows that molecular dynamics, applied under the correct conditions, is a viable tool for calculating the thermal conductivity of solid thin films. More generally, it demonstrates the potential of molecular dynamics for ascertaining microscale thermophysical properties in complex structures. [S0022-1481(00)02303-3]