Active control of the die-level temperature is desirable during production testing of high power microprocessors, so as to ensure accurate performance classification. Such control requires that the controlling thermal load time-lead the dissipated thermal load and that it be modulated to account for the distributed thermal capacitance and resistance of the device packaging. The analysis in this paper demonstrates fundamental limits of temperature control for typical devices under test conditions. These limits are identified for specified control power to die power ratios. The effects of test sequence design and device package design on the temperature control limits are also examined. The theory developed can be applied to any thermal control problem where a conductive medium separates the control source from the location where control is desired.
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e-mail: sweetlan@alum.mit.edu
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Technical Papers
Active Thermal Control of Distributed Parameter Systems With Application to Testing of Packaged IC Devices
Matthew Sweetland, Mem. ASME,
e-mail: sweetlan@alum.mit.edu
Matthew Sweetland, Mem. ASME
W. M. Rohsenow Heat and Mass Transfer Laboratory, Department of Mechanical Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Room 3-162, Cambridge, MA 02139-4307
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John H. Lienhard, V, Fellow ASME
e-mail: lienhard@mit.edu
John H. Lienhard, V, Fellow ASME
W. M. Rohsenow Heat and Mass Transfer Laboratory, Department of Mechanical Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Room 3-162, Cambridge, MA 02139-4307
Search for other works by this author on:
Matthew Sweetland, Mem. ASME
W. M. Rohsenow Heat and Mass Transfer Laboratory, Department of Mechanical Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Room 3-162, Cambridge, MA 02139-4307
e-mail: sweetlan@alum.mit.edu
John H. Lienhard, V, Fellow ASME
W. M. Rohsenow Heat and Mass Transfer Laboratory, Department of Mechanical Engineering, Massachusetts Institute of Technology, 77 Massachusetts Avenue, Room 3-162, Cambridge, MA 02139-4307
e-mail: lienhard@mit.edu
Contributed by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER. Manuscript received by the Heat Transfer Division December 18, 2001; revision received September 9, 2002. Associate Editor: G. S. Dulikravich.
J. Heat Transfer. Feb 2003, 125(1): 164-174 (11 pages)
Published Online: January 29, 2003
Article history
Received:
December 18, 2001
Revised:
September 9, 2002
Online:
January 29, 2003
Citation
Sweetland, M., and Lienhard, J. H., V (January 29, 2003). "Active Thermal Control of Distributed Parameter Systems With Application to Testing of Packaged IC Devices ." ASME. J. Heat Transfer. February 2003; 125(1): 164–174. https://doi.org/10.1115/1.1527908
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