In recent years, high-heat-flux cooling techniques have received great attention from researchers around the world due to its importance in thermal management of both commercial and defense high-power electronic devices. Although impressive progress has been made during the last few decades, high-heat-flux removal still largely remains as a challenging subject that needs further exploration and study. In this paper, we have reviewed recent developments in several high-heat-flux heat removal techniques, including microchannels, jet impingements, sprays, wettability effects, and piezoelectrically driven droplets. High-heat-flux removal can be achieved effectively by either single-phase flow or two-phase flow boiling heat transfer. Better understandings of the underlying heat transfer mechanisms for performance improvement are discussed.
Issue Section:
Review Articles
Keywords:
boiling,
drops,
heat transfer,
jets,
microchannel flow,
sprays,
two-phase flow,
wetting,
high heat flux,
extreme-high heat flxu,
jet impingement,
spray,
microchannel,
piezoelectric droplet,
wettability,
electronic cooling,
thermal management
Topics:
Cooling,
Drops,
Flow (Dynamics),
Flux (Metallurgy),
Heat,
Heat flux,
Heat transfer,
Microchannels,
Sprays,
Boiling,
Two-phase flow,
Water
References
1.
United States Semiconductor Industry Association (SIA), European Semiconductor Industry Association (ESIA), the Japan Electronics and Information Technology Industries Association (JEITA), the Korean Semiconductor Industry Association (KSIA), and the Taiwan Semiconductor Industry Association (TSIA), and, 2009, “
International Technology Roadmap for Semiconductors
,” http://www.itrs.net/Links/2009ITRS/Home2009.htmhttp://www.itrs.net/Links/2009ITRS/Home2009.htm.2.
Mudawar
, I.
, 2001, “Assessment of High-Heat-Flux Thermal Management Schemes
,” IEEE Trans. Compon. Packag. Technol.
, 24
(2
), pp. 122
–141
.3.
Savino
, R.
, Paterna
, D.
, and Abe
, Y.
, 2007, “Recent Developments in Heat Pipes: An Overview
,” Recent Pat. Eng.
, 1
(2
), pp. 153
–161
.4.
Sobhan
, C. B.
, Raq
, R. L.
, and Peterson
, G. P.
, 2007, “A Review and Comparative Study of the Investigations on Micro Heat Pipes
,” Int. J. Energy Res.
, 31
(6-7
), pp. 664
–688
.5.
Kakac
, S.
, and Pramuanjaroenkij
, A.
, 2009, “Review of Convective Heat Transfer Enhancement With Nanofluids
,” Int. J. Heat Mass Transfer
, 52
, pp. 3187
–3196
.6.
Ghiaasiaan
, S. M.
, and Abdel-Khalik
, S. I.
, 2001, “Two-Phase Flow in Micro-Channels
,” Adv. Heat Transfer
, 34
, pp. 145
–254
.7.
Obot
, N. T.
, 2002, “Toward a Better Understanding of Friction and Heat/mass Transfer in Micro-Channels - A Literature Review
,” Proceedings of the International Conference on Heat Transfer and Transport Phenomena in Microscale
, Banff, Canada
, pp. 54
–64
.8.
Morini
, G. L.
, 2004, “Single-Phase Convective Heat Transfer in Microchannels: A Review of Experimental Results
,” Int. J. Therm. Sci.
, 43
(7
), pp. 631
–651
.9.
Cheng
, P.
, Wang
, G.
, and Quan
, X.
, 2009, “Recent Work on Boiling and Condensation in Microchannels
,” J. Heat Transfer
, 131
, p. 043211
.10.
Roday
, A. P.
, and Jensen
, M. K.
, 2009, “A Review of the Critical Heat Flux Condition in Mini- and Microchannels
,” J. Mech. Sci. Technol.
, 23
, pp. 2529
, 2547
.11.
Kandlikar
, S. G.
, 2010, “History, Advances, and Challenges in Liquid Flow and Flow Boiling Heat Transfer in Microchannels: A Critical Review
,” Proceedings of the 14th International Heat Transfer Conference
, Washington, DC
, Paper No. IHTC14-23353.12.
Bertsch
, S. S.
, Groll
, E. A.
, and Garimella
, S. V.
, 2008, “Review and Comparative Analysis of Studies on Saturated Flow Boiling in Small Channels
,” Nanoscale Microscale Thermophys. Eng.
, 12
, pp. 187
–227
.13.
Downs
, S. J.
, and James
, E. H.
, 1987, “Jet Impingement Heat Transfer: A Literature Survey
,” ASME Paper No. 87-HT-35.14.
Jambunathan
, K.
, Lai
, E.
, Moss
, M. A.
, and Button
, B. L.
, 1992, “A Review of Heat Transfer Data for Single Circular Jet Impingement
,” Int. J. Heat Fluid Flow
, 13
(2
), pp. 106
–115
.15.
Gu
, C. B.
, Su
, G. S.
, Chow
, L. C.
, and Pais
, M. R.
, 1993, “Comparison of Spray and Jet Impingement Cooling
,” ASME Paper No. 93–HT–20.16.
Kim
, J.
, 2007, “Spray Cooling Heat Transfer: The State of the Art
,” Int. J. Heat Fluid Flow
, 28
, pp. 753
–767
.17.
Agostini
, B.
, Fabbri
, M.
, Park
, J. E.
, Wojtan
, L.
, and Thome
, J. R.
, 2007, “State of the Art of High Heat Flux Cooling Technologies
,” Heat Transfer Eng.
, 28
(4
), pp. 258
–281
.18.
Bar-Cohen
, A.
, Arik
, M.
, and Ohadi
, M.
, 2006, “Direct Liquid Cooling of High Flux Micro and Nano Electronic Components
,” Proc. IEEE
, 94
(8
), pp. 1549
–1570
.19.
Kandlikar
, S. G.
, and Bapat
, A. V.
, 2007, “Evaluation of Jet Impingement, Spray and Microchannel Chip Cooling Options for High Heat Flux Removal
,” Heat Transfer Eng.
, 28
(11
), pp. 911
–923
.20.
Tuckerman
, D. B.
, and Pease
, R. F. W.
, 1981, “High-Performance Heat Sinking for VLSI
,” IEEE Electron Device Lett.
, EDL-2
, pp. 126
–129
.21.
Pais
, M. R.
, Chow
, L. C.
, and Mahefkey
, E. T.
, 1992, “Surface Roughness and Its Effects on the Heat Transfer Mechanism in Spray Cooling
,” J. Heat Transfer
, 114
, pp. 211
–219
.22.
Silverman
, I.
, Yarin
, A. L.
, Reznik
, S. N.
, Arenshtam
, A.
, Kijet
, D.
, and Nagler
, A.
, 2006, “High Heat-Flux Accelerator Targets: Cooling With Liquid Metal Jet Impingement
,” Int. J. Heat Mass Transfer
, 49
(17–18
), pp. 2782
–2792
.23.
Mehendale
, S. S.
, Jacobi
, A. M.
, and Shah
, R. K.
, 2000, “Fluid Flow and Heat Transfer at Micro and Meso Scales with Application to Heat Exchanger Design
,” Appl. Mech. Rev.
, 53
(7
), pp. 175
–193
.24.
Kandlikar
, S. G.
, and Grande
, W. J.
, 2002, “Evolution of Microchannel Flow Passages – Thermohydraulic Performance and Fabrication Technology
,” ASME Paper No. IMECE2002-32043.25.
Kew
, P.
, and Cornwell
, K.
, 1997, “Correlations for the Prediction of Boiling Heat Transfer in Small-Diameter Channels
,” Appl. Therm. Eng.
, 17
, pp. 705
–715
.26.
Cheng
, P.
, and Wu
, H. Y.
, 2006, “Mesoscale and Microscale Phase-Change Heat Transfer
,” Adv. Heat Transfer
, 39
, pp. 461
–563
.27.
Kandlikar
, S. G.
, 2010, “Microchannels: Rapid Growth of a Nascent Technology
,” J. Heat Transfer
, 132
, p. 040301
.28.
Kosar
, A.
, and Peles
, Y.
, 2006, “Thermal-Hydraulic Performance of MEMS-Based Pin Fin Heat Sink
,” J. Heat Transfer
, 128
(2
), pp. 121
–131
.29.
Wei
, X.
, and Joshi
, Y.
, 2002, “Optimization Study of Stacked Micro-Channel Heat Sinks for Micro-Electronic Cooling
,” Proc. ITherm 2002
, San Diego, CA
, pp. 441
–448
.30.
Koo
, J.
, Jiang
, L.
, Bari
, A.
, Zhang
, L.
, Wang
, E.
, Kenny
, T. W.
, Santiago
, J. G.
, and Goodson
, K. E.
, 2002, “Convective Boiling in Microchannel Heat Sinks With Spatially-Varying Heat Generation
,” Proc. ITherm 2002
, San Diego, CA
, pp. 341
–346
.31.
Brunschwiler
, T.
, Michel
, B.
, Rothuizen
, H.
, Kloter
, U.
, Wunderle
, B.
, and Oppermann
, H.
, 2008, “Forced Convective Interlayer Cooling in Vertically Integrated Packages
,” Proc. ITherm 2008
, Orlando, FL
, pp. 1114
–1125
.32.
Kim
, Y. J.
, Joshi
, Y. K.
, Fedorov
, A. G.
, Lee
, Y.-J.
, and Lim
, S.-K.
, 2010, “Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux
,” J. Heat Transfer
, 132
, p. 041009
.33.
Husain
, A.
, and Kim
, K.-Y.
, 2009, “Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section
,” J. Electron. Packag.
, 131
, p. 021005
.34.
Li
, J.
, and Peterson
, G. P.
, 2007, “3-Dimensional Numerical Optimization of Silicon-Based High Performance Parallel Microchannel Heat Sink With Liquid Flow
,” Int. J. Heat Mass Transfer
, 50
, pp. 2895
–2904
.35.
Gong
, L.
, Kota
, K.
, Tao
, W.
, and Joshi
, Y.
, “Parametric Numerical Study of Flow and Heat Transfer in Microchannels With Wavy Walls
,” J. Heat Transfer
, 133
, p. 051702
.36.
Hirshfeld
, H.
, Silverman
, I.
, Arenshtam
, A.
, Kijel
, D.
, and Nagler
, A.
, 2006, “High Heat Flux Cooling of Accelerator Targets With Micro-Channels
,” Nucl. Instrum. Methods Phys. Res. A
, 562
(2
), pp. 903
–905
.37.
Colgan
, E. G.
, Furman
, B.
, Gaynes
, M.
, Graham
, W.
, LaBianca
, N.
, Polastre
, R. J.
, Rothwell
, M. B.
, Bezama, Choudhary
, R.
, Marston
, K.
, Toy
, H.
, Wakil
, J.
, Zitz
, and Schmidt
, R.
, 2005, “A Practical Implementation of Silicon Microchannel Coolers for High Power Chips
,” 21st IEEE SEMI-THERM Symp.
, pp. 1
–7
.38.
Walchli
, R.
, Brunschwiler
, T.
, Michel
, B.
, and Poulikakos
, D.
, 2010, “Self-Contained, Oscillating Flow Liquid Cooling System for Thin Form Factor High Performance Electronics
,” J. Heat Transfer
, 132
, p. 051401
.39.
Fang
, R.
, Jiang
, W.
, Khan
, J.
, and Dougal
, R.
, 2009, “Experimental Heat Transfer Enhancement for Single Phases Liquid Micro-Channel Cooling Using a Micro-Synthetic Jet Actuator
,” Proceedings of ASME 2009 2nd Micro/Nanoscale HeatMass Transfer International Conference
, Shanghai, China
, pp. 199
–206
.40.
Bogojevic
, D.
, Sefiance
, K.
, Walton
, A. J.
, Lin
, H.
, Cummins
, G.
, Kenning
, D. B. R.
, and Karayiannis
, T. G.
, 2011, “Experimental Investigation of Non-Uniform Heating Effect on Flow Boiling Instabilities in a Microchannel-Based Heat Sink
,” Int. J. Therm. Sci.
, 50
, pp. 309
–324
.41.
Kosar
, A.
, and Peles
, Y.
, 2007, “Critical Heat Flux of R-123 in Silicon-Based Microchannels
,” J. Heat Transfer
, 29
, pp. 844
–851
.42.
Lee
, J.
, and Mudawar
, I.
, 2009, “Critical Heat Flux for Subcooled Flow Boiling in Micro-Channel Heat Sinks
,” Int. J. Heat Mass Transfer
, 52
, pp. 3341
–3352
.43.
Krishnamurthy
, S.
, and Peles
, Y.
, 2010, “Flow Boiling Heat Transfer on Micro Pin Fins Entrenched in a Microchannel
,” J. Heat Transfer
, 132
, p. 041007
.44.
Wang
, H.
, and Peterson
, R. B.
, 2010, “Enhanced Boiling Heat Transfer in Parallel Microchannels With Diffusion Brazed Wire Mesh
,” IEEE Trans. Compon. Packag. Technol.
, 33
(4
), pp. 784
–793
.45.
Asthana
, A.
, Zinovik
, I.
, Weinmueller
, C.
, and Poulikakos
, D.
, 2011, “Significant Nusselt Number Increase in Microchannels With a Segmented Flow of Two Immiscible Liquids: An Experimental Study
,” Int. J. Heat Mass Transfer
, 54
, pp. 1456
–1464
.46.
Beltz
, A. R.
, Jenkins
, J. R.
, Kim
, C. J.
, and Attinger
, D.
, 2011, “Significant Boiling Enhancement With Surfaces Combining Superhydrophilic and Superhydrophobic Patters
,” Proceedings of 2011 IEEE 24th International Conference, MEMS
, Mexico
, pp. 1191
–1196
.47.
Zhang
, W.
, Liu
, G.
, Xu
, J.
, and Yang
, Y.
, 2009, “Effect of Channel Surface Wettability and Temperature Gradients on the Boiling Flow Pattern in a Single Microchannel
,” J. Micromech. Microeng.
, 19
, p. 055012
.48.
Liu
, T. Y.
, Li
, P. L.
, Liu
, C. W.
, and Gau
, C.
, 2011, “Boiling Flow Characteristics in Microchannels With Very Hydrophobic Surface to Super-Hydrophilic Surface
,” Int. J. Heat Mass Transfer
, 54
, pp. 126
–134
.49.
Hsieh
, S.-S.
, and Lin
, C.-Y.
, 2009, “Convective Heat Transfer in Liquid Microchannels With Hydrophobic and Hydrophilic Surfaces
,” Int. J. Heat Mass Transfer
, 52
, pp. 260
–270
.50.
Phan
, H. T.
, Caney
, N.
, Marty
, P.
, Colasson
, S.
, and Gavillet
, J.
, 2011, “Flow Boiling of Water on Titanium and Diamond-Like Carbon Coated Surfaces in a Microchannel
,” Fron. Heat Mass Transfer
, 2
, pp. 1
–6
.51.
Rosenggarten
, G.
, Cooper-White
, J.
, and Metcalfe
, G.
, 2006, “Experimental and Analytical Study of the Effect of Contact Angle on Liquid Convective Heat Transfer in Microchannels
,” Int. J. Heat Mass Transfer
, 49
, pp. 4161
–4170
.52.
Choi
, C.
, Shin
, J. S.
, Kim
, D. I. Y.
, and Kim
, M. H.
, 2010, “Flow Boiling Behaviors in Hydrophilic and Hydrophobic Microchannels
,” Exp. Therm. Fluid Sci.
, 35
(5
), pp. 816
–824
.53.
Liu
, Z.
, and Qiu
, Y.
, 2006, “Critical Heat Flux of Steady Boiling for Water Jet Impingement in Flat Stagnation Zone on Superhydrophilic Surface
,” J. Heat Transfer
, 128
(7
), pp. 726
–729
.54.
Baird
, E.
, and Mohseni
, K.
, 2008, “Digitized Heat Trasnfer: A New Paradigm for Thermal Management of Compact Micro Systems
,” IEEE Trans. Compon. Packag. Technol.
, 31
(1
), pp. 143
–151
.55.
Paik
, P.
, Chakrabarty
, K.
, and Pamula
, V. K.
, 2008, “A Digital-Microfluidics Approach to Chip Cooling
,” IEEE Des. Test Comput.
, 25
(4
), pp. 372
–381
.56.
Oprins
, H.
, Danneels
, J.
, Ham
, B. V.
, Vandevelde
, B.
, and Baelmans
, M.
, 2008, “Convection Heat Transfer in Electrostatic Actuated Liquid Droplets for Electronics Cooling
,” Microelectron. J.
, 39
, pp. 966
–974
.57.
Cheng
, J.-T.
, and Chen
, C. -L
, 2010, “Adaptive Chip Cooling Using Electrowetting on Coplanar Control Electrodes
,” Nanoscale Microscale Thermophys. Eng.
, 14
, pp. 63
–74
.58.
Fabbri
, M.
, Jiang
, S.
, and Dhir
, V. K.
, 2003, “Comparative Study of Spray and Multiple Micro Jets Cooling for High Power Density Electronic Applications
,” ASME Paper No. IMECE2003-42325.59.
Michna
, G. J.
, Browne
, E. A.
, Peles
, Y.
, and Jensen
, M. K.
, 2009, “Single-Phase Microscale Jet Stagnation Point Heat Transfer
,” J. Heat Transfer
, 131
, p. 111402
.60.
Womac
, D. J.
, Ramadhyani
, S.
, and Incropera
, F. P.
, 1993, “Correlating Equations for Impingement Cooling of Small Heat Sources With Single Circular Liquid Jets
,” J. Heat Transfer
, 115
(1
), pp. 106
–116
.61.
Garimella
, S. V.
, and Rice
, R. A.
, 1995, “Confined and Submerged Liquid Jet Impingement Heat Transfer
,” J. Heat Transfer
, 117
(4
), pp. 871
–877
.62.
Natarajan
, G.
, and Bezama
, R. J.
, 2006, “Ceramic Microjet Cooling Device
,” Proceedings of ASME ICNMM06, Parts A and B
, Limerick, Ireland
, pp. 263
–270
.63.
Koncar
, B.
, Norajitra
, P.
, and Oblak
, K.
, 2010, “Effect of Nozzle Sizes on Jet Impingement Heat Transfer in He-Cooled Divertor
,” Appl. Therm. Eng.
, 30
, pp. 697
–705
.64.
Browne
, E. A.
, Michna
, G. J.
, Jensen
, M. K.
, and Peles
, Y.
, 2010, “Experimental Investigation of Single-Phase Microjet Array Heat Transfer
,” J. Heat Transfer
, 132
, p. 041013
.65.
Sung
, M. K.
, and Mudawar
, I.
, 2008, “Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics
,” Proceedings of ITherm 2008
, Orlando, FL
, pp. 121
–131
.66.
Sleiti
, A. K.
, and Kapat
, J. S.
, 2006, “An Experimental Investigation of Liquid Jet Impingement and Single-Phase Spray Cooling Using Polyalphaolefin
,” Exp. Heat Transfer
, 19
(2
), pp. 149
–163
.67.
Martinez-Galvan
, E.
, Ramos
, J. C.
, Anton
, R.
, and Khodabandeh
, R.
, 2011, “Film Thickness and Heat Transfer Measurement in a Spray Cooling System With R134a
,” J. Heat Transfer
, 133
, p. 011002
.68.
Yan
, Z. B.
, Toh
, K. C.
, Duan
, F.
, Wong
, T. N.
, Choo
, K. F.
, Chan
, P. K.
, and Chua
, Y. S.
, 2010, “Experimental Study of Impingement Spray Cooling for High Power Devices
,” Appl. Therm. Eng.
, 30
, pp. 1225
–1230
.69.
Duursma
, G.
, Sefiane
, K.
, and Kennedy
, A.
, 2009, “Experimental Studies of Nanofluid Droplets in Spray Cooling
,” Heat Transfer Eng.
, 30
(13
), pp. 1108
–1120
.70.
Silk
, E. A.
, Kim
, J.
, and Kiger
, K.
, 2006, “Spray Cooling of Enhanced Surfaces: Impact of Structured Surface Geometry and Spray Axis Inclination
,” Int. J. Heat Mass Transfer
, 49
(25–26
), pp. 4910
–4920
.71.
Coursey
, J. S.
, Kim
, J.
, and Kiger
, K. T.
, 2007, “Spray Cooling of High Aspect Ratio Open Microchannels
,” J. Heat Transfer
, 129
, pp. 1052
–1059
.72.
Bostanci
, H.
, Ee
, D. V.
, Saarloos
, B. A.
, Rini
, D. P.
, and Chow
, L. C.
, 2009, “Spray Cooling of Power Electronics Using High Temperature Coolant and Enhanced Surface
,” Proceedings of Vehicle Power and Propulsion Conference
, IEEE
, pp. 609
–613
.73.
Srikar
, R.
, Gambaryan-Roisman
, T.
, Steffes
, C.
, Stephan
, P.
, Tropea
, C.
, and Yarin
, A. L.
, 2009, “Nanofiber Coating of Surfaces for Intensification of Drop or Spray Impact Cooling
,” Int. J. Heat Mass Transfer
, 52
, pp. 5814
–5826
.74.
Estes
, K. A.
, and Mudawar
, I.
, 1995, “Correlating of Sauter Mean Diameter and Critical Heat Flux for Spray Cooling of Small Surface
,” Int. J. Heat Mass Transfer
, 38
, pp. 2985
–2996
.75.
Visaria
, M.
, and Mudawar
, I.
, 2008, “Effects of High Subcooling on Two-Phase Spray Cooling and Critical Heat Flux
,” Int. J. Heat Mass Transfer
, 51
, pp. 5269
–5278
.76.
Visaria
, M.
, and Mudawar
, I.
, 2009, “Application of Two-Phase Spray Cooling for Thermal Management of Electronic Devices
,” IEEE Trans. Compon. Packag. Technol.
, 32
(4
), pp. 784
–793
.77.
Elston
, L. J.
, Yerkes
, K. L.
, Thomas
, S. K.
, and McQuillen
, J.
2009, “Cooling Performance of a 16-Nozzle Array in Variable Gravity
,” J. Thermophys. Heat Transfer
, 23
(3
), pp. 571
–581
.78.
Choi
, K. J.
, and Yao
, S. C.
, 1987, “Mechanisms of Film Boiling Heat Transfer of Normally Impacting Spray
,” Int. J. Heat Mass Transfer
, 30
(2
), pp. 311
–318
.79.
Huang
, Y.-L.
, Chang
, S.-H.
, Wang
, C.-H.
, and Lee
, C. -I
, 2005, “Piezoelectric Actuating Sprayed Phase-Change Cooling Technique for VLSI Chips
,” Proceedings of 2005 ASME Summer Heat Transfer Conference
, San Francisco, CA
, pp. 503
–509
.80.
Xia
, C.
, 2002, “Spray/jet Cooling for Heat Flux High to 1kW/cm2
,” 18th Annual IEEE Symposium on Semiconductor Thermal Measurement and Management
, pp. 1157
–1175
81.
Heffington
, S. N.
, and Glezer
, A.
, 2004, “Two-Phase Thermal Management Using a Small-Scale, Heat Transfer Cell Based on Vibration-Induced Droplet Atomizatio
,” Proceedings of ITherm 2004
, Las Vegas, NV
, pp. 90
–94
.82.
Heffington
, S. N.
, Black
, W. Z.
, and Glezer
, A.
, 2002, “Vibration-Induced Droplet Atomization Heat Transfer Cell for High-Heat Flux Dissipation
,” Proceedings of THERMES-2002
, Santa Fe, NM
.83.
Mudawar
, M.
, and Bowers
, M. B.
, 1999, “Ultra-High Critical Heat Flux (CHF) for Subcooled Water Flow Boiling-I: CHF Data and Parametric Effects for Small Diameter Tubes
,” Int. J. Heat Mass Transfer
, 31
, pp. 1405
–1428
.84.
Liu
, X.
, and Lienhard
, J. H.
, 1992, “Extremely High Heat Flux Removal by Subcooled Liquid Jet Impingement
,” Fundamentals of Subcooled Flow Boiling, ASME, HTD
, 217
, pp. 11
–20
.85.
Lee
, H. J.
, and Lee
, S. Y.
, 2001, “Heat Transfer Correlation for Boiling Flows in Small Rectangular Horizontal Channels With Low Aspect Ratios
,” Int. J. Multiphase Flow
, 27
, pp. 2043
–2062
.86.
Yan
, Y.-Y.
, and Lin
, T.-F.
, 1998, “Evaporation Heat Transfer and Pressure Drop of Refrigerant R-134a in a Small Pipe
,” Int. J. Heat Mass Transfer
, 41
, pp. 4183
–4194
.87.
Warrier
, G. R.
, Dhir
, V. K.
, and Momoda
, L. A.
, 2002, “Heat Transfer and Pressure Drop in Narrow Rectangular Channels
,” Exp. Therm. Fluid Sci.
, 26
, pp. 53
–64
.88.
Lin
, S.
, Kew
, P. A.
, and Cornwell
, K.
, 2001, “Two-Phase Heat Transfer to a Refrigerant in a 1 mm Diameter Tube
,” Int. J. Refrig.
, 24
, pp. 51
–56
.89.
Wambsganss
, M. W.
, France
, D. M.
, and Jendrzejczyk
, T. N.
, 1993, “Boiling Heat-Transfer in a Horizontal Small-Diameter Tube
,” J. Heat Transfer
, 115
(4
), pp. 963
–972
.90.
Tran
, T. N.
, Wambsganss
, D. M.
, and France
, D. M.
, 1996, “Small-Circular- and Rectangular-Channel Boiling With Two Refrigerants
,” Int. J. Multiphase Flow
, 22
, pp. 485
–498
.91.
Huo
, X.
, Chen
, L.
, Tian
, Y. S.
, and Karayiannis
, T. G.
, 2004, “Flow Boiling and Flow Regimes in Small Diameter Tubes
,” Appl. Therm. Eng.
, 24
, pp. 1225
–1239
.92.
Wen
, D. S.
, Yan
, Y.
, and Kenning
, D. B. R.
, 2004, “Saturated Flow Boiling of Water in a Narrow Channel: Time-Averaged Heat Transfer Coefficient and Correlations
,” Appl. Therm. Eng.
, 24
, pp. 1207
–1223
.93.
Bao
, Z. Y.
, Flectcher
, D. F.
, and Haynes
, B. S.
, 2000, “Flow Boiling Heat Transfer of Freon R11 and HCFC123 in Narrow Passages
,” Int. J. Heat Mass Transfer
, 43
, pp. 3347
–3358
.94.
Yu
, W.
, France
, D. M.
, Wambsganss
, M. W.
, and Hull
, J. R.
, 2002, “Two-Phase Pressure Drop, Boiling Heat Transfer, and Critical Heat Flux to Water in a Small-Diameter Horizontal Tube
,” Int. J. Multiphase Flow
, 28
, pp. 927
–941
.95.
Lazarek
, G. M.
, and Black
, S. H.
, 1982, “Evaporative Heat Transfer, Pressure Drop and Critical Heat Flux in a Small Vertical Tube With R-113
,” Int. J. Heat Mass Transfer
, 25
, pp. 945
–959
.96.
Alvarado
, J. L.
, and Lin
, Y.-P.
, 2010, “Nanostructured Surfaces for Enhanced Spray Cooling
,” 27th Army Science Conference
, Paper No. MP-10.97.
Hsieh
, C.-C.
, and Yao
, S.-C.
, 2006, “Evaporative Heat Transfer Characteristics of a Water Spray on Micro-Structured Silicon Surfaces
,” Int. J. Heat Mass Transfer
, 49
, pp. 962
–974
.98.
Ravigururajan
, T. S.
, 1998, “Impact of Channel Geometry on Two-Phase Flow Heat Transfer Characteristics of Refrigerants in Microchannel Heat Exchangers
,” J. Heat Transfer
, 120
, pp. 485
–491
.99.
Chien
, L.-H.
, and Chang
, C.-Y.
, 2011, “An Experimental Study of Two-Phase Multiple Jet Cooling on Finned Surfaces Using a Dielectric Fluid
,” Appl. Therm. Eng.
, 31
, pp. 1983
–1993
.100.
Amon
, C. H.
, Murthy
, J. Y.
, Yao
, S. C.
, Narumanchi
, S.
, Wu
, C. F.
, and Hsieh
, C. C.
, 2001, “MEMS Enabled Thermal Management of High-Heat-Flux Devices, Edifice: Embedded Droplet Impingement for Integrated Cooling of Electronics
,” Exp. Therm. Fluid Sci.
, 25
(5
), pp. 231
–242
.101.
Copeland
, D.
, 1998, “Single-Phase and Boiling Cooling of a Small Heat Source by Multiple Nozzle Jet Impingement
,” Int. J. Microelectron. Packag.
, 1
, pp. 105
–113
.102.
Bowers
, M. B.
, and Mudawar
, I.
, 1994, “High Flux Boiling in Low Flow Rate, Low Pressure Drop Mini-Channel and Micro-Channel Heat Sinks
,” Int. J. Heat Mass Transfer
, 37
(2
), pp. 321
–332
.103.
Wadsworth
, D. C.
, and Mudawar
, I.
, 1992, “Enhancement of Single-Phase Heat Transfer and Critical Heat Flux From an Ultra-High-Flux Simulated Microelectronic Heat Source to a Rectangular Impinging Jet of Dielectric Liquid
,” J. Heat Transfer
, 114
, pp. 764
–768
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