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Journal Articles

Aircraft Electro-Thermal Pulse Deicing

Accepted Manuscript
Siavash Khodakarami, Vaibhav Agarwal, Pouya Kabirzadeh, Alexandra Solecki, Muhammad Jahidul Hoque, Wentao Yang, Nicole Stokowski, Joshua Jacobs, Arindam Chatterji, Edward Lovelace, Andrew Stillwell, Nenad Miljkovic
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer.
Paper No: HT-24-1025
https://doi.org/10.1115/1.4066396
Published Online: September 2, 2024
View Article titled, Aircraft Electro-Thermal Pulse Deicing
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Topics: Aircraft, Deicing, Ice, Wings, Aerodynamics, Air travel, Aviation, Boundary layers, Computer simulation, Electrification
Journal Articles

Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)

Sevket U. Yuruker, Raphael K. Mandel, Patrick McCluskey, Michael M. Ohadi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. October 2021, 143(10): 101501.
Paper No: HT-21-1514
https://doi.org/10.1115/1.4051999
Published Online: September 8, 2021
View Article titled, Air Cooling of Power Electronics Through Vertically Enhanced Manifold Microchannel Systems (VEMMS)
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Topics: Cooling, Electronics, Flow (Dynamics), Heat, Heat sinks, Manifolds, Manufacturing, Microchannels, Switches, Thermal management
Journal Articles

Experimental Investigation of Composite Phase Change Material Heat Sinks for Enhanced Passive Thermal Management

Collier S. Miers, Amy Marconnet
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. January 2021, 143(1): 013001.
Paper No: HT-19-1689
https://doi.org/10.1115/1.4048620
Published Online: November 4, 2020
View Article titled, Experimental Investigation of Composite Phase Change Material Heat Sinks for Enhanced Passive Thermal Management
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Topics: Composite materials, Design, Heat, Heat sinks, Melting, Phase change materials, Temperature, Thermal management, Cycles, Thermal conductivity
Journal Articles

High-Flux Thermal Management With Supercritical Fluids

Brian M. Fronk, Alexander S. Rattner
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. December 2016, 138(12): 124501.
Paper No: HT-15-1603
https://doi.org/10.1115/1.4034053
Published Online: August 2, 2016
View Article titled, High-Flux Thermal Management With Supercritical Fluids
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Topics: Computer cooling, Cooling, Fluids, Flux (Metallurgy), Heat, Heat flux, Heat sinks, Heat transfer, Microchannels, Supercritical fluids
Journal Articles

Controlled Wetting in Nanoporous Membranes for Thin Film Evaporation

Kyle L. Wilke, Banafsheh Barabadi, TieJun Zhang, Evelyn N. Wang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Photo Gallery
J. Heat Mass Transfer. August 2016, 138(8): 080906.
Paper No: HT-16-1272
https://doi.org/10.1115/1.4033827
Published Online: July 8, 2016
View Article titled, Controlled Wetting in Nanoporous Membranes for Thin Film Evaporation
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Topics: Evaporation, Membranes, Thin films, Wetting, Floods, Liquid films, Aluminum, Capillarity, Cooling, Electronics
Journal Articles

Foreword

Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Foreword
J. Heat Mass Transfer. November 2013, 135(11): 110501.
Paper No: HT-13-1142
https://doi.org/10.1115/1.4024626
Published Online: September 23, 2013
View Article titled, Foreword
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Topics: Computer cooling, Cooling, Cutting, Electronics, Engineering teachers, Heat flux, Heat transfer, Momentum, Thermal systems, Transport processes
Journal Articles

High Heat Flux Cooling of Electronics: The Need for a Paradigm Shift

Heinz Herwig
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. November 2013, 135(11): 111013.
Paper No: HT-12-1318
https://doi.org/10.1115/1.4024621
Published Online: September 23, 2013
View Article titled, High Heat Flux Cooling of Electronics: The Need for a Paradigm Shift
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Topics: Cooling, Electronics, Heat flux
Journal Articles

Keeping Smartphones Cool With Gallium Phase Change Material

Haoshan Ge, Jing Liu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. May 2013, 135(5): 054503.
Paper No: HT-12-1231
https://doi.org/10.1115/1.4023392
Published Online: April 11, 2013
View Article titled, Keeping Smartphones Cool With Gallium Phase Change Material
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Topics: Containers, Gallium, Phase change materials, Temperature, Melting point, Heat, Electronics, Liquid metals, Heating
Journal Articles

Novel Hub Fins for Axial Flow Fans for the Enhancement of Impingement Heat Transfer on a Flat Plate

D. Sui, T. Kim, M. L. Xu, T. J. Lu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Briefs
J. Heat Mass Transfer. July 2009, 131(7): 074502.
https://doi.org/10.1115/1.3109244
Published Online: April 30, 2009
View Article titled, Novel Hub Fins for Axial Flow Fans for the Enhancement of Impingement Heat Transfer on a Flat Plate
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Topics: Fans, Fins, Flat plates, Flow (Dynamics), Heat transfer, Axial flow, Electronics
Journal Articles

Genetic Algorithm Based Optimization of PCM Based Heat Sinks and Effect of Heat Sink Parameters on Operational Time

Atul Nagose, Ankit Somani, Aviral Shrot, Arunn Narasimhan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. January 2008, 130(1): 011401.
https://doi.org/10.1115/1.2780182
Published Online: January 28, 2008
View Article titled, Genetic Algorithm Based Optimization of PCM Based Heat Sinks and Effect of Heat Sink Parameters on Operational Time
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Topics: Design, Genetic algorithms, Heat sinks, Optimization, Phase change materials, Flat heat pipes, Electronics
Journal Articles

Erratum: “Assessment of Overall Cooling Performance in Thermal Design of Electronics Based on Thermodynamics” [ Journal of Heat Transfer, 2001, 123(5), pp. 999–1005 ]

Ken Ogiso
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Errata
J. Heat Mass Transfer. January 2007, 129(1): 98.
https://doi.org/10.1115/1.2403180
Published Online: January 1, 2007
View Article titled, Erratum: “Assessment of Overall Cooling Performance in Thermal Design of Electronics Based on Thermodynamics” [ Journal of Heat Transfer, 2001, 123(5), pp. 999–1005 ]
Open the PDF for Erratum: “Assessment of Overall Cooling Performance in Thermal Design of Electronics Based on Thermodynamics” [ Journal of Heat Transfer, 2001, 123(5), pp. 999–1005 ] in another window
Topics: Cooling, Design, Electronics, Heat transfer, Thermodynamics
Journal Articles

Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

Donald C. Price, Life Fellow, ASME Principal Fellow,, B. Elliott Short,, Jr., Mem., ASME Senior Principal Mechanical Engineer,
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 11–17.
https://doi.org/10.1115/1.1839583
Published Online: February 15, 2005
View Article titled, Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls
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Topics: Computers, Design, Flow (Dynamics), Printed circuit boards, Temperature, Thermal management, Cooling, Electronics, Flight
Journal Articles

Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

Cristina H. Amon, S.-C. Yao, C.-F. Wu, C.-C. Hsieh
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Article
J. Heat Mass Transfer. January 2005, 127(1): 66–75.
https://doi.org/10.1115/1.1839586
Published Online: February 15, 2005
View Article titled, Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics
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Topics: Coolants, Cooling, Drops, Electronics, Engineering prototypes, Flow (Dynamics), Flux (Metallurgy), Heat, Heat flux, Heat transfer
Journal Articles

Assessment of Overall Cooling Performance in Thermal Design of Electronics Based on Thermodynamics

Ken Ogiso
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. October 2001, 123(5): 999–1005.
https://doi.org/10.1115/1.1387025
Published Online: February 20, 2001
View Article titled, Assessment of Overall Cooling Performance in Thermal Design of Electronics Based on Thermodynamics
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Topics: Cooling, Design, Entropy, Heat transfer, Flow (Dynamics), Pressure, Heat, Electronics, Thermal resistance
Journal Articles

Experimental and Numerical Investigation of Forced Convective Characteristics of Arrays of Channel Mounted Obstacles

T. J. Young, K. Vafai
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1999, 121(1): 34–42.
https://doi.org/10.1115/1.2825962
Published Online: February 1, 1999
View Article titled, Experimental and Numerical Investigation of Forced Convective Characteristics of Arrays of Channel Mounted Obstacles
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Topics: Air flow, Computer simulation, Convection, Cooling, Electronic components, Electronics, Failure, Flow (Dynamics), Flux (Metallurgy), Heat
Journal Articles

Two Constructal Routes to Minimal Heat Flow Resistance via Greater Internal Complexity

A. Bejan, N. Dan
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1999, 121(1): 6–14.
https://doi.org/10.1115/1.2825968
Published Online: February 1, 1999
View Article titled, Two Constructal Routes to Minimal Heat Flow Resistance via Greater Internal Complexity
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Topics: Flow (Dynamics), Geometry, Heat, Optimization, Design, Design methodology, Electrical conductivity, Thermal conductivity, Approximation, Composite materials
Journal Articles

A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages

S. Sathe, B. Sammakia
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1998, 120(4): 830–839.
https://doi.org/10.1115/1.2825902
Published Online: November 1, 1998
View Article titled, A Review of Recent Developments in Some Practical Aspects of Air-Cooled Electronic Packages
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Topics: Electronic packages, Energy dissipation, Heat sinks, Accounting, Adhesives, Cooling, Electronics, Heat, Heat transfer, Manufacturing
Journal Articles

Free Convection Limits for Pin-Fin Cooling

T. S. Fisher, K. E. Torrance
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. August 1998, 120(3): 633–640.
https://doi.org/10.1115/1.2824325
Published Online: August 1, 1998
View Article titled, Free Convection Limits for Pin-Fin Cooling
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Topics: Cooling, Natural convection, Optimization, Heat sinks, Electronics, Energy dissipation, Heat, Heat transfer, Inviscid flow, Porosity
Journal Articles

Nanoscale Temperature Distributions Measured by Scanning Joule Expansion Microscopy

A. Majumdar, J. Varesi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. May 1998, 120(2): 297–305.
https://doi.org/10.1115/1.2824245
Published Online: May 1, 1998
View Article titled, Nanoscale Temperature Distributions Measured by Scanning Joule Expansion Microscopy
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Topics: Joules, Microscopy, Nanoscale phenomena, Temperature, Temperature distribution, Atomic force microscopy, Imaging, Metals, Resolution (Optics), Signals
Journal Articles

An Investigation of Key Factors Affecting Solder Microdroplet Deposition

B. Xiong, C. M. Megaridis, D. Poulikakos, H. Hoang
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. February 1998, 120(1): 259–270.
https://doi.org/10.1115/1.2830051
Published Online: February 1, 1998
View Article titled, An Investigation of Key Factors Affecting Solder Microdroplet Deposition
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Topics: Solders, Contact resistance, Modeling, Shapes, Solidification, Drops, Electronic equipment, Electronics, Fluids, Liquid metals