Soft lithography was used to replicate nanoscale features made using electron beam lithography on a polymethylmethacrylate (PMMA) master. The PMMA masters were exposed to fluorinated silane vapors to passivate its surfaces so that polydimethylsiloxane (PDMS) did not permanently bond to the master. From scanning electron microscopy, the silanization process was found to deposit a coating on the master that was a few hundreds of nanometers thick. These silane films partially concealed the nanoscale holes on the PMMA master, causing the soft lithography process to produce PDMS features with dimensions that were significantly reduced. The thickness of the silane films was directly measured on silicon or PMMA masters and was found to increase with exposure time to silane vapors. These findings indicate that the thickness of the silane coatings is a critical parameter when using soft lithography to replicate nanoscale features, and caution should be taken on how long a master is exposed to silane vapors.
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November 2011
Research Papers
Effect of Silanization Film Thickness in Soft Lithography of Nanoscale Features
Lucas H. Ting,
Lucas H. Ting
Department of Mechanical Engineering,
University of Washington
, Seattle, WA 98195
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Shirin Feghhi,
Shirin Feghhi
Department of Mechanical Engineering,
University of Washington
, Seattle, WA 98195
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Sangyoon J. Han,
Sangyoon J. Han
Department of Mechanical Engineering,
University of Washington
, Seattle, WA 98195
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Marita L. Rodriguez,
Marita L. Rodriguez
Department of Mechanical Engineering,
University of Washington
, Seattle, WA 98195
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Nathan J. Sniadecki
Nathan J. Sniadecki
Department of Mechanical Engineering,
University of Washington
, Seattle, WA 98195
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Lucas H. Ting
Department of Mechanical Engineering,
University of Washington
, Seattle, WA 98195
Shirin Feghhi
Department of Mechanical Engineering,
University of Washington
, Seattle, WA 98195
Sangyoon J. Han
Department of Mechanical Engineering,
University of Washington
, Seattle, WA 98195
Marita L. Rodriguez
Department of Mechanical Engineering,
University of Washington
, Seattle, WA 98195
Nathan J. Sniadecki
Department of Mechanical Engineering,
University of Washington
, Seattle, WA 98195J. Nanotechnol. Eng. Med. Nov 2011, 2(4): 041006 (5 pages)
Published Online: April 4, 2012
Article history
Received:
June 4, 2011
Revised:
June 19, 2011
Published:
March 30, 2012
Online:
April 4, 2012
Citation
Ting, L. H., Feghhi, S., Han, S. J., Rodriguez, M. L., and Sniadecki, N. J. (April 4, 2012). "Effect of Silanization Film Thickness in Soft Lithography of Nanoscale Features." ASME. J. Nanotechnol. Eng. Med. November 2011; 2(4): 041006. https://doi.org/10.1115/1.4005665
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