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Journal Articles

Using Direct Simulation Monte Carlo With Improved Boundary Conditions for Heat and Mass Transfer in Microchannels

J. Yang, J. J. Ye, J. Y. Zheng, I. Wong, C. K. Lam, P. Xu, R. X. Chen, Z. H. Zhu
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. April 2010, 132(4): 041008.
https://doi.org/10.1115/1.4000880
Published Online: February 19, 2010
View Article titled, Using Direct Simulation Monte Carlo With Improved Boundary Conditions for Heat and Mass Transfer in Microchannels
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Topics: Boundary-value problems, Flow (Dynamics), Heat, Heat transfer, Mass transfer, Microchannels, Pressure, Simulation, Temperature, Wall temperature
Journal Articles

Predicting Erosion-Corrosion Induced by the Interactions Between Multiphase Flow and Structure in Piping System

P. Tang, J. Yang, J. Y. Zheng, C. K. Lam, I. Wong, S. Z. He
Journal: Journal of Pressure Vessel Technology
Publisher: ASME
Article Type: Research Papers
J. Pressure Vessel Technol. December 2009, 131(6): 061301.
https://doi.org/10.1115/1.4000063
Published Online: September 23, 2009
View Article titled, Predicting Erosion-Corrosion Induced by the Interactions Between Multiphase Flow and Structure in Piping System
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Topics: Corrosion, Erosion, Flow (Dynamics), Modeling, Multiphase flow, Pipes, Simulation, Failure, Deformation, Metals
Proceedings Papers

Using Improved DSMC Method in Simulating for the Heat and Mass Transfer in Microchannels

J. J. Ye, J. Yang, P. Tang, J. Y. Zheng, W. Z. Li, C. K. Lam, M. McKenna, Y. B. Ma
Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1507-1514, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-66915
https://doi.org/10.1115/IMECE2008-66915
View Paper titled, Using Improved DSMC Method in Simulating for the Heat and Mass Transfer in Microchannels
Open the PDF for Using Improved DSMC Method in Simulating for the Heat and Mass Transfer in Microchannels in another window
Topics: Heat, Mass transfer, Microchannels, Pressure, Wall temperature, Gas flow, Flow (Dynamics), Heat transfer, Machinery, Microelectromechanical systems