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Proceedings Papers

Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

Pradeep Lall, Hyesoo Jang, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 25–27, 2022
Paper No: IPACK2022-97432
https://doi.org/10.1115/IPACK2022-97432
View Paper titled, Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments
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Topics: Astronauts, Event history analysis, Manufacturing, Reliability, Sensors
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Paper No: IPACK2022-97457
https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
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Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021011.
Paper No: EP-22-1029
https://doi.org/10.1115/1.4055986
Published Online: November 23, 2022
View Article titled, Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
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Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics
Proceedings Papers

Additively Printed Flexible Temperature Sensor for Wearable Applications

Pradeep Lall, Hyesoo Jang, Jinesh Narangaparambil, Kartik Goyal, Curtis Hill
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 26–28, 2021
Paper No: IPACK2021-74071
https://doi.org/10.1115/IPACK2021-74071
View Paper titled, Additively Printed Flexible Temperature Sensor for Wearable Applications
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Topics: Reliability, Temperature sensors
Proceedings Papers

Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate

Pradeep Lall, Kartik Goyal, Kyle Schulze, Curtis Hill
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A003, October 26–28, 2021
Paper No: IPACK2021-74063
https://doi.org/10.1115/IPACK2021-74063
View Paper titled, Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate
Open the PDF for Print-Consistency and Process-Interaction for Inkjet-Printed Copper on Flexible Substrate in another window
Topics: Copper, Electronics, Inks, Sintering
Proceedings Papers

Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition

Pradeep Lall, Hyesoo Jang, Curtis Hill, Libby Creel
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A002, October 27–29, 2020
Paper No: IPACK2020-2644
https://doi.org/10.1115/IPACK2020-2644
View Paper titled, Reliability of Flexible Wearable Band With Printed Sensors for Vital Sign Acquisition
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Topics: Biometry, Fatigue life, Flexible electronics, Reliability, Sensors