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Proceedings Papers

Stability Analysis of an Evaporating and/or Condensing Thin Liquid Film

L. H. Chai, X. F. Peng, J. M. Ochterbeck
Proc. ASME. IMECE98, Heat Transfer: Volume 1 — Heat Transfer in Flowing Systems, 325-329, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0610
https://doi.org/10.1115/IMECE1998-0610
View Paper titled, Stability Analysis of an Evaporating and/or Condensing Thin Liquid Film
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Topics: Evaporation, Lubrication theory, Stability, Phase transitions, Surface tension, Accounting, Condensation, Navier-Stokes equations, Transport processes, Waves
Journal Articles

Opto-Electro-Thermal Modeling of Thin-Film Hydrogenated Amorphous Silicon (a-Si:H) Photovoltaic Cell

Jia-Jiun Lai, Basil T. Wong, Jasman Y.-H. Chai
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2021, 13(4): 041013.
Paper No: TSEA-20-1319
https://doi.org/10.1115/1.4048838
Published Online: January 18, 2021
View Article titled, Opto-Electro-Thermal Modeling of Thin-Film Hydrogenated Amorphous Silicon (a-Si:H) Photovoltaic Cell
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Topics: Acoustics, Electrons, Modeling, Phonons, Photovoltaic cells, Silicon, Temperature, Thin films, Simulation, Boundary-value problems
Proceedings Papers

Application of Infrared Imaging Technology in Fatigue Failure Prediction of Vehicle Wheel in Wheel Bending Fatigue Test

W. H. Chai, X. D. Liu, Y. C. Shan, J. G. Wang
Proc. ASME. IMECE2016, Volume 14: Emerging Technologies; Materials: Genetics to Structures; Safety Engineering and Risk Analysis, V014T11A004, November 11–17, 2016
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2016-66539
https://doi.org/10.1115/IMECE2016-66539
View Paper titled, Application of Infrared Imaging Technology in Fatigue Failure Prediction of Vehicle Wheel in Wheel Bending Fatigue Test
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Topics: Fatigue failure, Fatigue testing, Infrared imaging, Vehicles, Wheels, Fracture (Materials), Temperature distribution, Cycles, Glass fibers, High temperature
Journal Articles

Closure to Discussions on "Self-Organization and Self-Similarity in Boiling Systems, (2002, ASME J. of Heat Transfer, 124 (3), pp. 507–515)"

L. H. Chai, M. Shoji
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Discussion and Closure
J. Heat Mass Transfer. August 2004, 126(4): 663–665.
https://doi.org/10.1115/1.1755253
Published Online: August 1, 2004
View Article titled, Closure to Discussions on "Self-Organization and Self-Similarity in Boiling Systems, (2002, ASME J. of Heat Transfer, 124 (3), pp. 507–515)"
Open the PDF for Closure to Discussions on "Self-Organization and Self-Similarity in Boiling Systems, (2002, ASME J. of Heat Transfer, 124 (3), pp. 507–515)" in another window
Topics: Boiling, Fractals, Heat transfer, Renormalization (Physics), Self-organization, Statistical mechanics, Equilibrium (Physics), Engineering teachers, Complex systems, Thermodynamics
Journal Articles

Self-Organization and Self-Similarity in Boiling Systems

L. H. Chai, M. Shoji
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Technical Papers
J. Heat Mass Transfer. June 2002, 124(3): 507–515.
https://doi.org/10.1115/1.1470490
Published Online: May 10, 2002
View Article titled, Self-Organization and Self-Similarity in Boiling Systems
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Topics: Boiling, Equilibrium (Physics), Bubbles
Journal Articles

Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions

H. Chai, Y. Zohar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 137–142.
https://doi.org/10.1115/1.2792675
Published Online: September 1, 1999
View Article titled, Wire Sweep Due to Transfer Molding in a 160L QFP Package Under Steady-State Conditions
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Topics: Steady state, Transfer molding, Wire, Cavities, Density, Failure, Fluid dynamics, Transparency, Vehicles, Vents
Journal Articles

Unsteady Wire Sweep Due to Transfer Molding in a 160L QFP Package

H. Chai, Y. Zohar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 1999, 121(2): 127–134.
https://doi.org/10.1115/1.2792668
Published Online: June 1, 1999
View Article titled, Unsteady Wire Sweep Due to Transfer Molding in a 160L QFP Package
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Topics: Transfer molding, Wire, Flow (Dynamics), Displacement, Electronic components, Steady state, Stress, Vehicles
eBook Chapter

Bond Thickness Effect in Adhesive Joints and Its Significance for Mode I Interlaminar Fracture of Composites

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1986
https://doi.org/10.1520/STP35350S
ISBN-10: 0-8031-0447-2
ISBN: 978-0-8031-0447-1
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