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Journal Articles

Scaling Anomaly in the Mechanical Response in Microscale Reverse Extrusion of Copper

Bin Zhang, W. J. Meng
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Technical Briefs
J. Micro Nano-Manuf. March 2020, 8(1): 010910.
Paper No: JMNM-19-1068
https://doi.org/10.1115/1.4046043
Published Online: February 13, 2020
View Article titled, Scaling Anomaly in the Mechanical Response in Microscale Reverse Extrusion of Copper
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Topics: Extruding, Grain size, Microscale devices, Stress, Metalworking, Electron backscatter diffraction, Flow (Dynamics)
Proceedings Papers

Mechanical Response and Incomplete Filling in Compression Molding With Microscale Double-Punch Sets

Bin Zhang, M. Dodaran, S. Shao, W. J. Meng
Proc. ASME. IMECE2019, Volume 2A: Advanced Manufacturing, V02AT02A041, November 11–14, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2019-11521
https://doi.org/10.1115/IMECE2019-11521
View Paper titled, Mechanical Response and Incomplete Filling in Compression Molding With Microscale Double-Punch Sets
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Topics: Compression molding, Microscale devices
Journal Articles

Percolation Effect on the Piezoresistivity of Carbon Nanotube/Cement Composite as a Stress Self-Sensing Material

B. Qiao, N. Xie, J. Meng, T. Yan, L. Feng, J. Zhong
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Research-Article
J. Test. Eval.. November 2016, 44(6): 2261–2269.
Paper No: JTE20150033
https://doi.org/10.1520/JTE20150033
Published Online: November 29, 2016
View Article titled, Percolation Effect on the Piezoresistivity of Carbon Nanotube/Cement Composite as a Stress Self-Sensing Material
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Journal Articles

Fabrication of Gallium Nitride Films in a Chemical Vapor Deposition Reactor

J. Meng, S. Wong, Y. Jaluria
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. June 2015, 7(2): 021003.
Paper No: TSEA-14-1170
https://doi.org/10.1115/1.4029353
Published Online: June 1, 2015
View Article titled, Fabrication of Gallium Nitride Films in a Chemical Vapor Deposition Reactor
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Topics: Chemical vapor deposition, Computer simulation, Disks, Flow (Dynamics), Gallium nitride, Manufacturing, Metalorganic chemical vapor deposition, Pressure, Semiconductor wafers, Temperature
Proceedings Papers

Fabrication of GaN Films in a Chemical Vapor Deposition Reactor

J. Meng, Y. Jaluria, S. Wong
Proc. ASME. MNHMT2013, ASME 2013 4th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T07A001, December 11–14, 2013
Publisher: American Society of Mechanical Engineers
Paper No: MNHMT2013-22053
https://doi.org/10.1115/MNHMT2013-22053
View Paper titled, Fabrication of GaN Films in a Chemical Vapor Deposition Reactor
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Topics: Chemical vapor deposition, Gallium nitride, Manufacturing, Flow (Dynamics), Transport processes, Buoyancy, Fluids, Geometry, Inflow, Metalorganic chemical vapor deposition
Journal Articles

Roll Molding of Microchannel Arrays on Al and Cu Sheet Metals: A Method for High-Throughput Manufacturing

Bin Lu, W. J. Meng
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. March 2014, 2(1): 011007.
Paper No: JMNM-13-1053
https://doi.org/10.1115/1.4025978
Published Online: December 4, 2013
View Article titled, Roll Molding of Microchannel Arrays on Al and Cu Sheet Metals: A Method for High-Throughput Manufacturing
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Topics: Manufacturing, Microchannels, Molding, Rollers, Sheet metal, Strips, Stress, Flow (Dynamics)
Journal Articles

Quantification of Thermal Resistance of Transient-Liquid-Phase Bonded Cu/Al/Cu Interfaces for Assembly of Cu-Based Microchannel Heat Exchangers

Bin Lu, Ke Chen, W. J. Meng, Amar Karki, Rongying Jin
Journal: Journal of Micro and Nano-Manufacturing
Publisher: ASME
Article Type: Research-Article
J. Micro Nano-Manuf. September 2013, 1(3): 031001.
Paper No: JMNM-12-1053
https://doi.org/10.1115/1.4024683
Published Online: July 9, 2013
View Article titled, Quantification of Thermal Resistance of Transient-Liquid-Phase Bonded Cu/Al/Cu Interfaces for Assembly of Cu-Based Microchannel Heat Exchangers
Open the PDF for Quantification of Thermal Resistance of Transient-Liquid-Phase Bonded Cu/Al/Cu Interfaces for Assembly of Cu-Based Microchannel Heat Exchangers in another window
Topics: Annealing, Bonding, Microchannels, Temperature, Tension-leg platforms, Thermal conductivity, Thermal resistance, Transients (Dynamics), Heat transfer, Manufacturing
Journal Articles

Tribological Testing of Steel Coupons Bonded to Cu-Based Microchannel Heat Exchangers

Fanghua Mei, W. J. Meng, Carl H. Hager, Liang A. Xue, Ryan D. Evans, Gary L. Doll
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. July 2011, 133(3): 032201.
https://doi.org/10.1115/1.4003858
Published Online: July 21, 2011
View Article titled, Tribological Testing of Steel Coupons Bonded to Cu-Based Microchannel Heat Exchangers
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Topics: Cooling, Friction, Heat exchangers, Lubrication, Microchannels, Steel, Testing, Tribology, Wear, Temperature
Proceedings Papers

Fluid Flow and Heat Transfer Characteristics of Ethylene Glycol and Water in Copper-Based Microchannel Devices

Fanghua Mei, B. Lu, W. J. Meng, S. Guo
Proc. ASME. HT2009, Volume 1: Heat Transfer in Energy Systems; Thermophysical Properties; Heat Transfer Equipment; Heat Transfer in Electronic Equipment, 885-895, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: HT2009-88328
https://doi.org/10.1115/HT2009-88328
View Paper titled, Fluid Flow and Heat Transfer Characteristics of Ethylene Glycol and Water in Copper-Based Microchannel Devices
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Topics: Copper, Fluid dynamics, Heat transfer, Microchannels, Water, Flow (Dynamics), Manufacturing, Metals, Testing, Coolants
Journal Articles

A Non-Resonance Method for Measuring Dynamic Soil Properties

GJ Rix, J Meng
Journal: Geotechnical Testing Journal
Publisher: ASTM International
Article Type: Research-Article
Geotech. Test. J.. January 2005, 28(1): 1–8.
https://doi.org/10.1520/GTJ12125
Published Online: January 1, 2005
View Article titled, A Non-Resonance Method for Measuring Dynamic Soil Properties
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Journal Articles

Navier-Stokes Equations and Turbulence. Encyclopedia of Math and its Applications, Vol. 83

C Foias,, Author, O Manley,, Author, Consultant, R Rosa,, Author, R Temam,, Author, J Meng,, Reviewer
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Book Reviews
Appl. Mech. Rev. May 2002, 55(3): B57.
https://doi.org/10.1115/1.1470686
Published Online: June 10, 2002
View Article titled, Navier-Stokes Equations and Turbulence. Encyclopedia of Math and its Applications, Vol. 83
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Topics: Mathematics, Navier-Stokes equations, Turbulence