1-12 of 12
J. Qu
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Proceedings Papers

Prognostic Tools for Small Cracks in Structures

D. L. McDowell, R. W. Neu, J. Qu, A. Saxena
Proc. ASME. IMECE97, Emerging Technologies for Machinery Health Monitoring and Prognosis, 1-12, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1264
https://doi.org/10.1115/IMECE1997-1264
View Paper titled, Prognostic Tools for Small Cracks in Structures
Open the PDF for Prognostic Tools for Small Cracks in Structures in another window
Topics: Fracture (Materials), Failure, High cycle fatigue, Maintenance, Sensors, Algorithms, Dimensions, Fatigue, Crack propagation, Defense industry
Proceedings Papers

Damage in Ceramic Matrix Composites With Arbitrary Microstructures

V. N. Bulsara, R. Talreja, J. Qu
Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 441-446, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0698
https://doi.org/10.1115/IMECE1997-0698
View Paper titled, Damage in Ceramic Matrix Composites With Arbitrary Microstructures
Open the PDF for Damage in Ceramic Matrix Composites With Arbitrary Microstructures in another window
Topics: Ceramic matrix composites, Damage, Fibers, Composite materials, Finite element analysis, Microscopy
Journal Articles

Effect of the Aero-Engine Mounting Stiffness on the Whole Engine Coupling Vibration

M. J. Qu, G. Chen
Journal: Journal of Engineering for Gas Turbines and Power
Publisher: ASME
Article Type: Research-Article
J. Eng. Gas Turbines Power. July 2018, 140(7): 072501.
Paper No: GTP-16-1443
https://doi.org/10.1115/1.4038542
Published Online: April 10, 2018
View Article titled, Effect of the Aero-Engine Mounting Stiffness on the Whole Engine Coupling Vibration
Open the PDF for Effect of the Aero-Engine Mounting Stiffness on the Whole Engine Coupling Vibration in another window
Topics: Rotors, Shapes, Stators, Stiffness, Vibration, Engines, Aircraft engines, Modeling, Finite element model, Finite element analysis
Proceedings Papers

Constitutive Modeling of Lead-Free Solders

M. Pei, J. Qu
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1307-1311, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73411
https://doi.org/10.1115/IPACK2005-73411
View Paper titled, Constitutive Modeling of Lead-Free Solders
Open the PDF for Constitutive Modeling of Lead-Free Solders in another window
Topics: Lead-free solders, Modeling, Solders, Thermomechanics, Tin, Alloys, Creep, Curve fitting, Deformation, Fatigue
Journal Articles

Elastic T -Stress Solutions of Embedded Elliptical Cracks Subjected to Uniaxial and Biaxial Loadings

J Qu, X Wang
Journal: Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. June 2006, 3(6): 1–14.
https://doi.org/10.1520/JAI100347
Published Online: June 1, 2006
View Article titled, Elastic T -Stress Solutions of Embedded Elliptical Cracks Subjected to Uniaxial and Biaxial Loadings
Open the PDF for Elastic T -Stress Solutions of Embedded Elliptical Cracks Subjected to Uniaxial and Biaxial Loadings in another window
Journal Articles

A Self-Consistent Model for the Inelastic Deformation of Nanocrystalline Materials

L. Capolungo, M. Cherkaoui, J. Qu
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Special Section On Nanomaterials And Nanomechanics
J. Eng. Mater. Technol. October 2005, 127(4): 400–407.
https://doi.org/10.1115/1.1925288
Published Online: February 22, 2005
View Article titled, A Self-Consistent Model for the Inelastic Deformation of Nanocrystalline Materials
Open the PDF for A Self-Consistent Model for the Inelastic Deformation of Nanocrystalline Materials in another window
Topics: Deformation, Dislocations, Grain boundaries, Grain size, Nanocrystals, Stress, Composite materials, Yield stress
Journal Articles

Application of the ASTM Loop Abrasion Test to Cylindrical Specimens

J Qu, JJ Truhan, PJ Blau
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Research-Article
J. Test. Eval.. January 2005, 33(1): 9–13.
https://doi.org/10.1520/JTE12508
Published Online: January 1, 2005
View Article titled, Application of the ASTM Loop Abrasion Test to Cylindrical Specimens
Open the PDF for Application of the ASTM Loop Abrasion Test to Cylindrical Specimens in another window
Journal Articles

Application of Laser Ultrasonics to Develop Dispersion Curves for Elastic Plates

C. Eisenhardt, L. J. Jacobs, J. Qu
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Brief Notes
J. Appl. Mech. December 1999, 66(4): 1043–1045.
https://doi.org/10.1115/1.2791781
Published Online: December 1, 1999
View Article titled, Application of Laser Ultrasonics to Develop Dispersion Curves for Elastic Plates
Open the PDF for Application of Laser Ultrasonics to Develop Dispersion Curves for Elastic Plates in another window
Topics: Elastic plates, Lasers, Ultrasonics
Journal Articles

Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages

Q. Yao, J. Qu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 196–201.
https://doi.org/10.1115/1.2792684
Published Online: September 1, 1999
View Article titled, Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages
Open the PDF for Three-Dimensional Versus Two-Dimensional Finite Element Modeling of Flip-Chip Packages in another window
Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect
Journal Articles

Characterizing the Failure Envelope of a Conductive Adhesive

D. Olliff, J. Qu, M. Gaynes, R. Kodnani, A. Zubelewicz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 23–30.
https://doi.org/10.1115/1.2792657
Published Online: March 1, 1999
View Article titled, Characterizing the Failure Envelope of a Conductive Adhesive
Open the PDF for Characterizing the Failure Envelope of a Conductive Adhesive in another window
Topics: Adhesives, Failure, Shear (Mechanics), Coulombs, Tension, Bonding, Compression, Copper, Finite element model, Mechanical testing
eBook Chapter

Mixed-Mode Fracture Mechanics Parameters of Elliptical Interface Cracks in Anisotropic Bimaterials

Series: ASTM Selected Technical Papers
Publisher: ASTM International
Published: 1999
https://doi.org/10.1520/STP14248S
ISBN-10: 0-8031-2602-6
ISBN: 978-0-8031-2602-2
Open the PDF for Mixed-Mode Fracture Mechanics Parameters of Elliptical Interface Cracks in Anisotropic Bimaterials in another window
Journal Articles

Interfacial Fracture Mechanics for Anisotropic Bimaterials

J. Qu, J. L. Bassani
Journal: Journal of Applied Mechanics
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. June 1993, 60(2): 422–431.
https://doi.org/10.1115/1.2900810
Published Online: June 1, 1993
View Article titled, Interfacial Fracture Mechanics for Anisotropic Bimaterials
Open the PDF for Interfacial Fracture Mechanics for Anisotropic Bimaterials in another window
Topics: Anisotropy, Fracture mechanics, Fracture (Materials), Oscillations, Stress