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Journal Articles

Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints

Y. W. Chan, T. H. Ju, Saeed A. Hareb, Y. C. Lee, Jih-Shun Wu, Mirng-Ji Lii
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 246–253.
https://doi.org/10.1115/1.1451844
Published Online: July 26, 2002
View Article titled, Reliability Modeling for Ball Grid Array Assembly With a Large Number of Warpage Affected Solder Joints
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Topics: Manufacturing, Reliability, Shapes, Solder joints, Solders, Warping, Modeling, Ball-Grid-Array packaging, Fatigue life, Cavities