1-3 of 3
K. N. Shukla
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Erratum: “Hydrodynamics of Diffusive Processes” [ASME Appl. Mech. Rev., 2001, 54 (5), pp. 391–404; DOI: 10.1115/1.1399288 ]

K. N. Shukla
Journal: Applied Mechanics Reviews
Publisher: ASME
Article Type: Errata
Appl. Mech. Rev. May 2019, 71(3): 037001.
Paper No: AMR-19-1034
https://doi.org/10.1115/1.4043784
Published Online: July 8, 2019
View Article titled, Erratum: “Hydrodynamics of Diffusive Processes” [ASME Appl. Mech. Rev., 2001, 54 (5), pp. 391–404; DOI: 10.1115/1.1399288 ]
Open the PDF for Erratum: “Hydrodynamics of Diffusive Processes” [ASME Appl. Mech. Rev., 2001, 54 (5), pp. 391–404; DOI: 10.1115/1.1399288 ] in another window
Topics: Fluids, Hydrodynamics
Journal Articles

Heat Transfer Limitation of a Micro Heat Pipe

K. N. Shukla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2009, 131(2): 024502.
https://doi.org/10.1115/1.3103970
Published Online: April 2, 2009
View Article titled, Heat Transfer Limitation of a Micro Heat Pipe
Open the PDF for Heat Transfer Limitation of a Micro Heat Pipe in another window
Topics: Heat pipes, Heat transfer, Vapors, Heat
Journal Articles

Thermal Math Modeling and Analysis of an Electronic Assembly

K. N. Shukla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 372–378.
https://doi.org/10.1115/1.1388561
Published Online: May 5, 2000
View Article titled, Thermal Math Modeling and Analysis of an Electronic Assembly
Open the PDF for Thermal Math Modeling and Analysis of an Electronic Assembly in another window
Topics: Finite element methods, Heat, Heat transfer coefficients, Manufacturing, Mathematics, Modeling, Temperature, Temperature distribution, Thermal analysis, Printed circuit boards