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Journal Articles

Mechanical Behavior of Electron Beam Powder Bed Fusion Additively Manufactured Ti6Al4V Parts at Elevated Temperatures

Md Jamal Mian, Jafar Razmi, Leila Ladani
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. February 2021, 143(2): 021013.
Paper No: MANU-20-1171
https://doi.org/10.1115/1.4049092
Published Online: December 16, 2020
View Article titled, Mechanical Behavior of Electron Beam Powder Bed Fusion Additively Manufactured Ti6Al4V Parts at Elevated Temperatures
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Topics: High temperature, Temperature, Anisotropy, Electron beams, Fracture (Materials), Additive manufacturing, Mechanical properties, Fracture (Process), Tensile strength, Stress
Proceedings Papers

Multi-Physics Modeling of Laser Interaction With Surface in Powder Bed Melting Process

Faiyaz Ahsan, Jafar Razmi, Leila Ladani
Proc. ASME. IMECE2018, Volume 2: Advanced Manufacturing, V002T02A085, November 9–15, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2018-86566
https://doi.org/10.1115/IMECE2018-86566
View Paper titled, Multi-Physics Modeling of Laser Interaction With Surface in Powder Bed Melting Process
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Topics: Lasers, Melting, Modeling, Physics, Absorption, Heat, Additive manufacturing, Cathode ray oscilloscopes, Electron beams, Gaussian distribution
Journal Articles

Influence of Microstructure on the High-Frequency Ultrasound Measurement of Peak Density

Jeremy Stromer, Leila Ladani
Journal: Journal of Nondestructive Evaluation, Diagnostics and Prognostics of Engineering Systems
Publisher: ASME
Article Type: Research-Article
ASME J Nondestructive Evaluation. November 2018, 1(4): 041008–041008-10.
Paper No: NDE-17-1102
https://doi.org/10.1115/1.4041067
Published Online: August 31, 2018
View Article titled, Influence of Microstructure on the High-Frequency Ultrasound Measurement of Peak Density
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Topics: Density, Electromagnetic scattering, Simulation
Journal Articles

Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study

Soud Farhan Choudhury, Leila Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041003.
Paper No: EP-14-1099
https://doi.org/10.1115/1.4031523
Published Online: September 25, 2015
View Article titled, Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study
Open the PDF for Effect of Intermetallic Compounds on the Thermomechanical Fatigue Life of Three-Dimensional Integrated Circuit Package Microsolder Bumps: Finite Element Analysis and Study in another window
Topics: Cycles, Fatigue life, Finite element analysis, Solders, Stress, Thermomechanics, Geometry, Reliability, Integrated circuits, Intermetallic compounds
Proceedings Papers

Molecular Dynamics Simulation of Mechanical Interface Behavior of Copper and Single Walled Carbon Nanotube Bundles

Ibrahim Awad, Leila Ladani
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A068, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-39089
https://doi.org/10.1115/IMECE2014-39089
View Paper titled, Molecular Dynamics Simulation of Mechanical Interface Behavior of Copper and Single Walled Carbon Nanotube Bundles
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Topics: Copper, Molecular dynamics simulation, Single-walled carbon nanotubes, Carbon nanotubes, Displacement, Slabs, Composite materials, Electrical properties, Molecular dynamics, Oscillations
Proceedings Papers

Anisotropic Behavior of Single Grain Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A056, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-40196
https://doi.org/10.1115/IMECE2014-40196
View Paper titled, Anisotropic Behavior of Single Grain Cu 6 Sn 5 Intermetallic
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Topics: Anisotropy, Intermetallic compounds, Tin, Solder joints, Bonding, Crystals, Electron backscatter diffraction, Grain size, Nanoindentation, Reliability
Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
https://doi.org/10.1115/1.4027992
Published Online: October 6, 2014
View Article titled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
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Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress
Journal Articles

Cohesive Zone Model for the Interface of Multiwalled Carbon Nanotubes and Copper: Molecular Dynamics Simulation

Ibrahim Awad, Leila Ladani
Journal: Journal of Nanotechnology in Engineering and Medicine
Publisher: ASME
Article Type: Research-Article
J. Nanotechnol. Eng. Med. August 2014, 5(3): 031007.
Paper No: NANO-14-1056
https://doi.org/10.1115/1.4029462
Published Online: August 1, 2014
View Article titled, Cohesive Zone Model for the Interface of Multiwalled Carbon Nanotubes and Copper: Molecular Dynamics Simulation
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Topics: Copper, Molecular dynamics simulation, Multi-walled carbon nanotubes, Simulation, Stress, Temperature, Displacement, Atoms
Journal Articles

Mechanical Anisotropy and Strain Rate Dependency Behavior of Ti6Al4V Produced Using E-Beam Additive Fabrication

Leila Ladani, Jafar Razmi, Soud Farhan Choudhury
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. July 2014, 136(3): 031006.
Paper No: MATS-13-1186
https://doi.org/10.1115/1.4027729
Published Online: June 5, 2014
View Article titled, Mechanical Anisotropy and Strain Rate Dependency Behavior of Ti6Al4V Produced Using E-Beam Additive Fabrication
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Topics: Anisotropy, Electron beams, Manufacturing, Nanoindentation, Elastic moduli, Tensile strength, Mechanical properties, Fracture (Materials)
Journal Articles

Interfacial Strength Between Single Wall Carbon Nanotubes and Copper Material: Molecular Dynamics Simulation

Ibrahim Awad, Leila Ladani
Journal: Journal of Nanotechnology in Engineering and Medicine
Publisher: ASME
Article Type: Research-Article
J. Nanotechnol. Eng. Med. November 2013, 4(4): 041001.
Paper No: NANO-13-1084
https://doi.org/10.1115/1.4026939
Published Online: March 12, 2014
View Article titled, Interfacial Strength Between Single Wall Carbon Nanotubes and Copper Material: Molecular Dynamics Simulation
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Topics: Atoms, Carbon nanotubes, Copper, Displacement, Molecular dynamics simulation, Shear strength, Single-walled carbon nanotubes, Oscillations, Simulation, Composite materials
Proceedings Papers

Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic

Soud Farhan Choudhury, Leila Ladani
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A020, July 16–18, 2013
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2013-73315
https://doi.org/10.1115/IPACK2013-73315
View Paper titled, Experimental Observation of the Effect of Crystallographic Orientation on Mechanical Behavior of Single Crystal Cu 6 Sn 5 Intermetallic
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Topics: Crystals, Intermetallic compounds, Mechanical behavior, Tin, Solder joints, Electron backscatter diffraction, Nanoindentation, Anisotropy, Creep, Ductility
Proceedings Papers

Mechanical Behavior of Ti-6Al-4V Manufactured by Electron Beam Additive Fabrication

Leila Ladani, Lalit Roy
Proc. ASME. MSEC2013, Volume 1: Processing, V001T01A001, June 10–14, 2013
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2013-1105
https://doi.org/10.1115/MSEC2013-1105
View Paper titled, Mechanical Behavior of Ti-6Al-4V Manufactured by Electron Beam Additive Fabrication
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Topics: Cathode ray oscilloscopes, Electron beams, Manufacturing, Mechanical behavior, Tensile strength, Anisotropy, Mechanical properties, Aerospace industry, Corrosion resistance, Density
Proceedings Papers

In Vivo Mechanical Characterization of Micro-Specimens Using a Novel Micro-Electro-Mechanical System

Leila Ladani, Daniel Preston
Proc. ASME. SBC2011, ASME 2011 Summer Bioengineering Conference, Parts A and B, 823-824, June 22–25, 2011
Publisher: American Society of Mechanical Engineers
Paper No: SBC2011-53338
https://doi.org/10.1115/SBC2011-53338
View Paper titled, In Vivo Mechanical Characterization of Micro-Specimens Using a Novel Micro-Electro-Mechanical System
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Topics: Biological tissues, Biomechanics, Deformation, Design, Diseases, Finite element analysis, Machinery, Mechanical properties, Microelectromechanical systems, Microscale devices
Journal Articles

Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints

Ousama M. Abdelhadi, Leila Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021004.
Paper No: EP-12-1069
https://doi.org/10.1115/1.4023846
Published Online: March 28, 2013
View Article titled, Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
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Topics: Solder joints, Soldering, Solders, Temperature, Tin, Intermetallic compounds
Journal Articles

Transition of Crack Propagation Path Under Varied Levels of Load in Bimodal Grain Size Al-Mg Alloy

Leila Ladani, Steven Nelson
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 2011, 133(4): 041017.
https://doi.org/10.1115/1.4004693
Published Online: October 27, 2011
View Article titled, Transition of Crack Propagation Path Under Varied Levels of Load in Bimodal Grain Size Al-Mg Alloy
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Topics: Crack propagation, Damage, Failure, Finite element analysis, Fracture (Materials), Grain size, Nucleation (Physics), Stress, Aluminum alloys, Alloys