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Journal Articles

In Situ Deformation of Silicon Cantilever Under Constant Stress as a Function of Temperature

Ming Gan, Yang Zhang, Vikas Tomar
Journal: Journal of Nanotechnology in Engineering and Medicine
Publisher: ASME
Article Type: Research-Article
J. Nanotechnol. Eng. Med. May 2014, 5(2): 021004.
Paper No: NANO-14-1035
https://doi.org/10.1115/1.4027877
Published Online: August 19, 2014
View Article titled, In Situ Deformation of Silicon Cantilever Under Constant Stress as a Function of Temperature
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Topics: Cantilevers, Creep, Deformation, Silicon, Stress, Temperature
Journal Articles

Raman Thermometry Based Thermal Conductivity Measurement of Bovine Cortical Bone as a Function of Compressive Stress

Yang Zhang, Ming Gan, Vikas Tomar
Journal: Journal of Nanotechnology in Engineering and Medicine
Publisher: ASME
Article Type: Research-Article
J. Nanotechnol. Eng. Med. May 2014, 5(2): 021003.
Paper No: NANO-14-1034
https://doi.org/10.1115/1.4027989
Published Online: August 19, 2014
View Article titled, Raman Thermometry Based Thermal Conductivity Measurement of Bovine Cortical Bone as a Function of Compressive Stress
Open the PDF for Raman Thermometry Based Thermal Conductivity Measurement of Bovine Cortical Bone as a Function of Compressive Stress in another window
Topics: Bone, Lasers, Stress, Temperature, Thermal conductivity, Compressive stress, Thermal conductivity measurement, Temperature measurement
Journal Articles

Correlating Microscale Thermal Conductivity of Heavily-Doped Silicon With Simultaneous Measurements of Stress

Ming Gan, Vikas Tomar
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research Papers
J. Eng. Mater. Technol. October 2011, 133(4): 041013.
https://doi.org/10.1115/1.4004699
Published Online: October 20, 2011
View Article titled, Correlating Microscale Thermal Conductivity of Heavily-Doped Silicon With Simultaneous Measurements of Stress
Open the PDF for Correlating Microscale Thermal Conductivity of Heavily-Doped Silicon With Simultaneous Measurements of Stress in another window
Topics: Cantilevers, Microscale devices, Silicon, Stress, Thermal conductivity, Atomic force microscopy, Heating, Sensors, Temperature, Nanoindentation