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Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011109.
Paper No: EP-22-1035
DOI: https://doi.org/10.1115/1.4056477
Published Online: January 11, 2023
View Article titled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Click here to open pdf in another window PDF for Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver
Journal Articles

Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging

Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011108.
Paper No: EP-22-1030
DOI: https://doi.org/10.1115/1.4056412
Published Online: December 23, 2022
View Article titled, Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging
Click here to open pdf in another window PDF for Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging
Topics: Batteries, Cycles, Lithium-ion batteries, Machine learning, Regression models, Reliability, Stress
Proceedings Papers

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Golam Rakib Mazumder, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A002, October 25–27, 2022
Paper No: IPACK2022-93878
DOI: https://doi.org/10.1115/IPACK2022-93878
View Paper titled, Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder
Click here to open pdf in another window PDF for Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder
Topics: Creep, Damage, Lead-free solders, Solders
Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022
Paper No: IPACK2022-97452
DOI: https://doi.org/10.1115/IPACK2022-97452
View Paper titled, Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
Click here to open pdf in another window PDF for Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration
Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics
Proceedings Papers

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

Pradeep Lall, Ved Soni
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A010, October 25–27, 2022
Paper No: IPACK2022-97451
DOI: https://doi.org/10.1115/IPACK2022-97451
View Paper titled, SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates
Click here to open pdf in another window PDF for SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates
Topics: Batteries, Biomedical equipment, Cycles, Electronics, Errors, Flexible electronics, Industrial research, Model validation, Modeling, Service life (Equipment)
Proceedings Papers

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Pradeep Lall, Ved Soni, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A009, October 25–27, 2022
Paper No: IPACK2022-97450
DOI: https://doi.org/10.1115/IPACK2022-97450
View Paper titled, Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries
Click here to open pdf in another window PDF for Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries
Topics: Circuits, Electronics, Printing
Proceedings Papers

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A011, October 25–27, 2022
Paper No: IPACK2022-97440
DOI: https://doi.org/10.1115/IPACK2022-97440
View Paper titled, Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging
Click here to open pdf in another window PDF for Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging
Topics: Copper, Delamination, Displacement, Fracture (Materials), High temperature, Stress
Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022
Paper No: IPACK2022-97438
DOI: https://doi.org/10.1115/IPACK2022-97438
View Paper titled, High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
Click here to open pdf in another window PDF for High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C
Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry
Proceedings Papers

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A008, October 25–27, 2022
Paper No: IPACK2022-97437
DOI: https://doi.org/10.1115/IPACK2022-97437
View Paper titled, Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform
Click here to open pdf in another window PDF for Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform
Topics: Artificial neural networks, Geometry, Inks, Printing, Dimensions, Particulate matter, Computer software, Control algorithms, Electronics, Regression models
Proceedings Papers

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, October 25–27, 2022
Paper No: IPACK2022-97430
DOI: https://doi.org/10.1115/IPACK2022-97430
View Paper titled, Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
Click here to open pdf in another window PDF for Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components
Topics: Circuits, Electronics, Temperature, Surface mount components, Filters, Manufacturing, Printing, Wearable devices, Energy dissipation, Heat
Proceedings Papers

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Paper No: IPACK2022-97433
DOI: https://doi.org/10.1115/IPACK2022-97433
View Paper titled, Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
Click here to open pdf in another window PDF for Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation
Topics: High temperature, Modeling, Reliability, Flip-chip, Solder joints, Ball-Grid-Array packaging, Electronics, Fatigue failure, Fatigue life, Materials degradation
Proceedings Papers

Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A008, October 25–27, 2022
Paper No: IPACK2022-97427
DOI: https://doi.org/10.1115/IPACK2022-97427
View Paper titled, Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure
Click here to open pdf in another window PDF for Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure
Topics: Delamination, Epoxy adhesives, Epoxy resins, High temperature, Modeling
Proceedings Papers

Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

Pradeep Lall, Hyesoo Jang, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A007, October 25–27, 2022
Paper No: IPACK2022-97432
DOI: https://doi.org/10.1115/IPACK2022-97432
View Paper titled, Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments
Click here to open pdf in another window PDF for Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments
Topics: Astronauts, Event history analysis, Manufacturing, Reliability, Sensors
Proceedings Papers

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 25–27, 2022
Paper No: IPACK2022-97428
DOI: https://doi.org/10.1115/IPACK2022-97428
View Paper titled, Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits
Click here to open pdf in another window PDF for Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits
Topics: Circuits, Drops, Electronics, Equipment performance, Experimental design, Inks, Manufacturing, Materials properties, Mechanical properties, Nanoparticles
Proceedings Papers

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A012, October 25–27, 2022
Paper No: IPACK2022-97457
DOI: https://doi.org/10.1115/IPACK2022-97457
View Paper titled, Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
Click here to open pdf in another window PDF for Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability
Topics: Artificial neural networks, Circuits, Copper, Flexible electronics, High temperature, Reliability, Electrical resistivity, Sintering, Adhesives, Electronics
Proceedings Papers

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A011, October 25–27, 2022
Paper No: IPACK2022-97456
DOI: https://doi.org/10.1115/IPACK2022-97456
View Paper titled, Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
Click here to open pdf in another window PDF for Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications
Topics: Adhesives, Anisotropy, Circuits, Electrical properties, Failure, Reliability, Temperature, Electronics, Low temperature, Bonding
Proceedings Papers

ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging

Pradeep Lall, Hyesoo Jang
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A006, October 25–27, 2022
Paper No: IPACK2022-97431
DOI: https://doi.org/10.1115/IPACK2022-97431
View Paper titled, ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging
Click here to open pdf in another window PDF for ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging
Topics: Artificial neural networks, Batteries, Lithium-ion batteries, Machine learning, Reliability, Simulation
Proceedings Papers

Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

Pradeep Lall, Aathi Raja Ram Pandurangan, Jaimal Williamson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 25–27, 2022
Paper No: IPACK2022-97424
DOI: https://doi.org/10.1115/IPACK2022-97424
View Paper titled, Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
Click here to open pdf in another window PDF for Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures
Topics: Delamination, Fatigue, Fracture toughness, Temperature
Proceedings Papers

Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging

Pradeep Lall, Yunli Zhang, Jeff Suhling, Jaimal Williamson, Pat Thompson
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A014, October 25–27, 2022
Paper No: IPACK2022-97453
DOI: https://doi.org/10.1115/IPACK2022-97453
View Paper titled, Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging
Click here to open pdf in another window PDF for Characterization of Fatigue Crack Growth of Epoxy Molding Compounds Under High-Temperature Long-Term Aging
Topics: Epoxy adhesives, Epoxy resins, Fatigue, Fatigue cracks, High temperature, Molding, Reliability
Proceedings Papers

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022
Paper No: IPACK2022-97449
DOI: https://doi.org/10.1115/IPACK2022-97449
View Paper titled, Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days
Click here to open pdf in another window PDF for Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days
Topics: Mechanical properties, Solders, Temperature, Alloys, Storage, Aerospace industry, Automotive industry, Constitutive equations, Finite element analysis, Low temperature materials