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Rajesh Jha
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Journal Articles

Temperature Regimes and Chemistry for Stabilizing Precipitation Hardening Phases in Al–Sc Alloys: Combined CALPHAD–Deep Machine Learning

Rajesh Jha, George S. Dulikravich
Journal: ASME Open Journal of Engineering
Publisher: ASME
Article Type: Research Papers
ASME Open J. Engineering. January 2022, 1: 011021.
Paper No: AOJE-21-1070
https://doi.org/10.1115/1.4054368
Published Online: May 9, 2022
View Article titled, Temperature Regimes and Chemistry for Stabilizing Precipitation Hardening Phases in Al–Sc Alloys: Combined CALPHAD–Deep Machine Learning
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Topics: Alloys, Temperature, Simulation, Heat treating (Metalworking)
Proceedings Papers

A Combined Experimental-Computational Approach to Design Optimization of High Temperature Alloys

Rajesh Jha, George S. Dulikravich, Frank Pettersson, Henrik Saxén, Nirupam Chakraborti
Proc. ASME. ETAM2014, ASME 2014 Symposium on Elevated Temperature Application of Materials for Fossil, Nuclear, and Petrochemical Industries, 62-72, March 25–27, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ETAM2014-1008
https://doi.org/10.1115/ETAM2014-1008
View Paper titled, A Combined Experimental-Computational Approach to Design Optimization of High Temperature Alloys
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Topics: Alloys, Design, High temperature, Optimization, Chemistry, Rupture, Algorithms, Artificial neural networks, Computer programming, Databases
Proceedings Papers

Conjugate Analysis of Thin Film Heat Spreaders to Reduce Temperature at Hot Spots

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Rajesh Jha
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A023, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-52804
https://doi.org/10.1115/IMECE2015-52804
View Paper titled, Conjugate Analysis of Thin Film Heat Spreaders to Reduce Temperature at Hot Spots
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Topics: Flat heat pipes, Temperature, Thin films, Airfoils, Circuits, Coating processes, Coatings, Cross section (Physics), Diamonds, Fins
Proceedings Papers

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Cesar C. Pacheco, Genesis Vasquez, Rajesh Jha, Marcelo J. Colaco, Helcio R. B. Orlande
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48242
https://doi.org/10.1115/IPACK2015-48242
View Paper titled, Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot
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Topics: Cooling, Electronics, Heat flux, Pareto optimization, Fins, Stress, Temperature, Design, Shapes, Airfoils