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Journal Articles

Unileg Thermoelectric Module Comprised by Coated Halide-Perovskite Thin Film

Shrikant Saini, Ajay Kumar Baranwal, Tomohide Yabuki, Shuzi Hayase, Koji Miyazaki
Journal: Journal of Heat Transfer
Article Type: Technical Briefs
J. Heat Transfer. July 2020, 142(7): 074502.
Paper No: HT-19-1562
DOI: https://doi.org/10.1115/1.4047360
Published Online: June 10, 2020
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Topics: Thin films, Electrical conductivity, Temperature, Thermal conductivity
Proceedings Papers

Uni-Leg Thermoelectric Module Comprised by Coated Hybrid-Perovskite Thin Film

Shrikant Saini, Ajay Kumar Baranwal, Tomohide Yabuki, Shuzi Hayase, Koji Miyazaki
Proc. ASME. MNHMT2019, ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T06A003, July 8–10, 2019
Paper No: MNHMT2019-4162
DOI: https://doi.org/10.1115/MNHMT2019-4162
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Topics: Thin films, Electrical conductivity, Flexible electronics, Thermal conductivity, Energy conversion, Glass, Spin coating, Temperature, Thermal energy
Proceedings Papers

Contribution of Microlayer Evaporation to Bubble Growth in Pool Saturated Boiling of Water

Tomohide Yabuki, Takuya Saitoh, Osamu Nakabeppu
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A013, June 16–19, 2013
Paper No: ICNMM2013-73211
DOI: https://doi.org/10.1115/ICNMM2013-73211
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Topics: Boiling, Bubbles, Evaporation, Water, Heat transfer, Heat flux, Microelectromechanical systems, Sensors, Temperature, Temperature measurement
Proceedings Papers

Study on Heat Transfer Mechanism of Isolated Bubble Nucleate Boiling With MEMS Sensors

Tomohide Yabuki, Osamu Nakabeppu
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 515-521, August 8–13, 2010
Paper No: IHTC14-22794
DOI: https://doi.org/10.1115/IHTC14-22794
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Topics: Bubbles, Heat transfer, Microelectromechanical systems, Nucleate boiling, Sensors, Temperature measurement
Proceedings Papers

Heat Transfer Characteristics of Isolated Bubble Nucleate Boiling of Water

Tomohide Yabuki, Osamu Nakabeppu
Proc. ASME. AJTEC2011, ASME/JSME 2011 8th Thermal Engineering Joint Conference, T10196, March 13–17, 2011
Paper No: AJTEC2011-44519
DOI: https://doi.org/10.1115/AJTEC2011-44519
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Topics: Bubbles, Heat transfer, Nucleate boiling, Water, Temperature, Evaporation, Heat, Heat flux, Microelectromechanical systems, Sensors
Proceedings Papers

Approach to Heat Transfer Mechanism Beneath Boiling Bubble With MEMS Sensor

Tomohide Yabuki, Osamu Nakabeppu
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2, 41-47, December 18–21, 2009
Paper No: MNHMT2009-18244
DOI: https://doi.org/10.1115/MNHMT2009-18244
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Topics: Boiling, Bubbles, Heat transfer, Microelectromechanical systems, Sensors