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Proceedings Papers

Development of the AI-Assisted Thermal Hydraulic Analysis Method for Condensing Bubbles in Vertical Subcooled Flow Boiling

Wen Zhou, Shuichiro Miwa, Koji Okamoto, Tomio Okawa, Ryoma Tsujimura, Thanh-Binh Nguyen
Proc. ASME. ICONE31, Volume 11: Student Paper Competition, V011T15A011, August 4–8, 2024
Publisher: American Society of Mechanical Engineers
Paper No: ICONE31-133410
https://doi.org/10.1115/ICONE31-133410
View Paper titled, Development of the AI-Assisted Thermal Hydraulic Analysis Method for Condensing Bubbles in Vertical Subcooled Flow Boiling
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Topics: Boiling, Bubbles, Condensation, Flow (Dynamics), Subcooling
Journal Articles

Analysis of Long-Term Performance and Snowmelt Capacity of Anti-Freezing Asphalt Pavement

Shujuan Wu, Mulian Zheng, Qing Liu, Wen Zhou, Yifeng Li, Zonghui Ma
Journal: Advances in Civil Engineering Materials
Publisher: ASTM International
Article Type: Technical Papers
Adv. Civ. Eng. Matls.. October 2020, 9(1): 683–710.
Paper No: ACEM20200026
https://doi.org/10.1520/ACEM20200026
Published Online: December 17, 2020
View Article titled, Analysis of Long-Term Performance and Snowmelt Capacity of Anti-Freezing Asphalt Pavement
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Journal Articles

Evaluation and Optimization of Grouting Treatment for Composite Pavement

Qun Yang, Ying-Jie Deng, Wen-Zhou Sun
Journal: Journal of Testing and Evaluation
Publisher: ASTM International
Article Type: Research-Article
J. Test. Eval.. March 2016, 44(2): 752–761.
Paper No: JTE20150231
https://doi.org/10.1520/JTE20150231
Published Online: March 2, 2016
View Article titled, Evaluation and Optimization of Grouting Treatment for Composite Pavement
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Journal Articles

High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry

Elena Martynenko, Wen Zhou, Alexander Chudnovsky, Ron S. Li, Larry Poglitsch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 254–259.
https://doi.org/10.1115/1.1462628
Published Online: July 26, 2002
View Article titled, High Cycle Fatigue Resistance and Reliability Assessment of Flexible Printed Circuitry
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Topics: Displacement, Failure, Fatigue, Fracture (Materials), High cycle fatigue, Reliability, Stress, Temperature, Circuits, Testing