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Proceedings Papers

Reliability Analysis on the Chaos Induced by the Effect of the Transient Temperature Variation of a Printed Wiring Board

Xiaoling He, Robert Fulton
Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 257-263, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/EPP-24733
https://doi.org/10.1115/IMECE2001/EPP-24733
View Paper titled, Reliability Analysis on the Chaos Induced by the Effect of the Transient Temperature Variation of a Printed Wiring Board
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Topics: Chaos, Event history analysis, Nonlinear dynamics, Printed circuit boards, Temperature, Transients (Dynamics)
Proceedings Papers

Nonlinear Dynamics Analysis of a Printed Wiring Board With Simple and Clamped Boundary Conditions

Xiaoling He
Proc. ASME. IMECE2001, Vibration and Control of Mechanical Systems, 101-109, November 11–16, 2001
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2001/DE-23213
https://doi.org/10.1115/IMECE2001/DE-23213
View Paper titled, Nonlinear Dynamics Analysis of a Printed Wiring Board With Simple and Clamped Boundary Conditions
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Topics: Boundary-value problems, Laminates, Nonlinear dynamics, Printed circuit boards
Proceedings Papers

Nonlinear Thermal and Mechanical Analysis in the Vibration of a Printed Wiring Board

Xiaoling He, Robert Fulton
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 25-34, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2243
https://doi.org/10.1115/IMECE2000-2243
View Paper titled, Nonlinear Thermal and Mechanical Analysis in the Vibration of a Printed Wiring Board
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Topics: Printed circuit boards, Vibration, Stress, Laminates, Temperature, Deflection, Dynamic analysis, Equations of motion, Failure, Modal analysis
Proceedings Papers

Nonlinear Vibration of a Thin Laminate Due to the Stochastic Thermal Diffusion

Xiaoling He
Proc. ASME. IDETC-CIE2009, Volume 4: 7th International Conference on Multibody Systems, Nonlinear Dynamics, and Control, Parts A, B and C, 1381-1382, August 30–September 2, 2009
Publisher: American Society of Mechanical Engineers
Paper No: DETC2009-86335
https://doi.org/10.1115/DETC2009-86335
View Paper titled, Nonlinear Vibration of a Thin Laminate Due to the Stochastic Thermal Diffusion
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Topics: Laminates, Noise (Sound), Nonlinear vibration, Thermal diffusion, Vibration
Proceedings Papers

Contact Dynamics With Onset of Plasticity in Probing Nanoscale Thin Solid Films by AFM and Nanoindentation

Xiaoling He
Proc. ASME. IDETC-CIE2009, Volume 1: 22nd Biennial Conference on Mechanical Vibration and Noise, Parts A and B, 409-412, August 30–September 2, 2009
Publisher: American Society of Mechanical Engineers
Paper No: DETC2009-87646
https://doi.org/10.1115/DETC2009-87646
View Paper titled, Contact Dynamics With Onset of Plasticity in Probing Nanoscale Thin Solid Films by AFM and Nanoindentation
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Topics: Atomic force microscopy, Contact dynamics, Nanoindentation, Nanoscale phenomena, Plasticity, Thin films, Adhesion, Deformation, Dynamics (Mechanics), Stick-slip
Proceedings Papers

Nonlinear Thermal Vibration Analysis of a Thin Laminated Microstructure

Xiaoling He
Proc. ASME. IDETC-CIE2005, Volume 1: 20th Biennial Conference on Mechanical Vibration and Noise, Parts A, B, and C, 1433-1438, September 24–28, 2005
Publisher: American Society of Mechanical Engineers
Paper No: DETC2005-85326
https://doi.org/10.1115/DETC2005-85326
View Paper titled, Nonlinear Thermal Vibration Analysis of a Thin Laminated Microstructure
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Topics: Approximation, Boundary-value problems, Buckling, Chaos, Deformation, Energy conservation, Equations of motion, Laminates, Nonlinear dynamics, Steady state
Proceedings Papers

Thermal Stress Induced Void Formation in Semiconductor Interconnect

Xiaoling He, Clemens Burda
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 255-258, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39513
https://doi.org/10.1115/IMECE2002-39513
View Paper titled, Thermal Stress Induced Void Formation in Semiconductor Interconnect
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Topics: Semiconductors (Materials), Simulation, Stress, Thermal stresses, Delamination, Stress concentration, Cycles, Deformation, Failure, Metals
Journal Articles

A Coupled Motion of the Thermally Induced Fluid Convection and the Membrane Motion

Xiaoling He
Journal: Journal of Computational and Nonlinear Dynamics
Publisher: ASME
Article Type: Research Papers
J. Comput. Nonlinear Dynam. July 2008, 3(3): 031005.
https://doi.org/10.1115/1.2908258
Published Online: April 30, 2008
View Article titled, A Coupled Motion of the Thermally Induced Fluid Convection and the Membrane Motion
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Topics: Attractors, Bifurcation, Chaos, Convection, Flow (Dynamics), Fluids, Membranes, Oscillations, Stability, Transients (Dynamics)
Journal Articles

The Nonlinear Behaviors of a Symmetric Isotropic Laminate in a Mixed Boundary Condition Subject to an Arbitrary Thermal Field Coupled with Mechanical Loading

Xiaoling He
Journal: Journal of Computational and Nonlinear Dynamics
Publisher: ASME
Article Type: Research Papers
J. Comput. Nonlinear Dynam. April 2006, 1(2): 168–177.
https://doi.org/10.1115/1.2166118
Published Online: December 10, 2005
View Article titled, The Nonlinear Behaviors of a Symmetric Isotropic Laminate in a Mixed Boundary Condition Subject to an Arbitrary Thermal Field Coupled with Mechanical Loading
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Topics: Boundary-value problems, Deflection, Laminates, Steady state, Temperature, Transients (Dynamics), Vibration, Equations of motion
Journal Articles

Chaotic Behavior of a Symmetric Laminate With Transient Thermal Field

Xiaoling He
Journal: Journal of Vibration and Acoustics
Publisher: ASME
Article Type: Technical Papers
J. Vib. Acoust. August 2006, 128(4): 429–438.
https://doi.org/10.1115/1.2128646
Published Online: May 27, 2005
View Article titled, Chaotic Behavior of a Symmetric Laminate With Transient Thermal Field
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Topics: Chaos, Deflection, Equations of motion, Laminates, Oscillations, Stress, Transients (Dynamics), Temperature, Boundary-value problems
Journal Articles

Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board

Xiaoling He, Robert E. Fulton, Fellow ASME Professor
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 77–84.
https://doi.org/10.1115/1.1457454
Published Online: May 2, 2002
View Article titled, Nonlinear Dynamics Analysis of a Laminated Printed Wiring Board
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Topics: Deflection, Laminates, Printed circuit boards, Stress, Nonlinear dynamics, Stress analysis (Engineering), Deformation, Equations of motion, Resonance