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Y. K. Joshi
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Journal Articles

Review of Interaction of Bullets and Fragments With Skin-Bone-Muscle Parenchyma

Punit Kumar Pandey, Y. K. Joshi, S. G. Ganpule
Journal: Journal of Engineering and Science in Medical Diagnostics and Therapy
Publisher: ASME
Article Type: Review Articles
ASME J of Medical Diagnostics. November 2025, 8(4): 040801.
Paper No: JESMDT-24-1044
https://doi.org/10.1115/1.4067766
Published Online: March 11, 2025
View Article titled, Review of Interaction of Bullets and Fragments With Skin-Bone-Muscle Parenchyma
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Topics: Biological tissues, Bone, Bullets, Projectiles, Skin, Wounds, Muscle
Proceedings Papers

Assessments of Single-Phase Liquid Cooling Enhancement Techniques for Microelectronic Systems

H. Y. Zhang, D. Pinjala, M. K. Iyer, R. Nagarajan, Y. K. Joshi, T. N. Wong, K. C. Toh
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 43-50, July 17–22, 2005
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2005-73040
https://doi.org/10.1115/IPACK2005-73040
View Paper titled, Assessments of Single-Phase Liquid Cooling Enhancement Techniques for Microelectronic Systems
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Topics: Cooling, Metal foams, Microchannels, Pressure drop, Heat sinks, Silicon, Aluminum, Brazing, Copper, Density
Proceedings Papers

Numerical Simulation of Flow and Heat Transfer Inside a Micro-Channel With One Dimpled Surface

X. J. Wei, Y. K. Joshi, P. M. Ligrani
Proc. ASME. IMECE2002, Heat Transfer, Volume 7, 149-156, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-33725
https://doi.org/10.1115/IMECE2002-33725
View Paper titled, Numerical Simulation of Flow and Heat Transfer Inside a Micro-Channel With One Dimpled Surface
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Topics: Computer simulation, Flow (Dynamics), Heat transfer, Microchannels, Turbulence, Boundary-value problems, Laminar flow, Microscale devices, Pressure drop, Shear (Mechanics)
Journal Articles

Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface

X. J. Wei, Y. K. Joshi, P. M. Ligrani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 63–70.
https://doi.org/10.1115/1.2429711
Published Online: March 2, 2006
View Article titled, Numerical Simulation of Laminar Flow and Heat Transfer Inside a Microchannel With One Dimpled Surface
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Topics: Flow (Dynamics), Heat transfer, Laminar flow, Microchannels, Microscale devices, Computer simulation
Journal Articles

Heat Transfer in Discretely Heated Side-Vented Compact Enclosures by Combined Conduction, Natural Convection, and Radiation

E. Yu, Y. K. Joshi
Journal: ASME Journal of Heat and Mass Transfer
Publisher: ASME
Article Type: Research Papers
J. Heat Mass Transfer. November 1999, 121(4): 1002–1010.
https://doi.org/10.1115/1.2826050
Published Online: November 1, 1999
View Article titled, Heat Transfer in Discretely Heated Side-Vented Compact Enclosures by Combined Conduction, Natural Convection, and Radiation
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Topics: Heat conduction, Heat transfer, Natural convection, Radiation (Physics)
Journal Articles

Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure

L. Tang, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 108–115.
https://doi.org/10.1115/1.2792664
Published Online: June 1, 1999
View Article titled, Integrated Thermal Analysis of Natural Convection Air Cooled Electronic Enclosure
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Topics: Natural convection, Thermal analysis, Boundary-value problems, Computational fluid dynamics, Temperature, Ceramics, Electronic components, Electronic systems, Flux (Metallurgy), Heat
Journal Articles

Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study

D. Pal, Y. K. Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 40–50.
https://doi.org/10.1115/1.2792199
Published Online: March 1, 1997
View Article titled, Application of Phase Change Materials to Thermal Control of Electronic Modules: A Computational Study
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Topics: Phase change materials, Laminates, Transients (Dynamics), Computation, Computer simulation, Cooling, Cooling systems, Density, Dimensions, Enthalpy
Journal Articles

Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity

D. Mukutmoni, Y. K. Joshi, M. D. Kelleher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 294–300.
https://doi.org/10.1115/1.2792108
Published Online: December 1, 1995
View Article titled, Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity
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Topics: Computation, Thermal conductivity, Heat, Coolants, Cooling, Electrical measurement, Electronic components, Fluid dynamics, Fluids, Heat sinks