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Journal Articles

Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films

Ian Chin, Wei Keat Loh, Seow Chien Kee, Yi He, Mohd. Zulkifly Abdullah, Masahiro Tsuriya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011009.
Paper No: EP-23-1055
https://doi.org/10.1115/1.4066083
Published Online: August 24, 2024
View Article titled, Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
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Topics: Absorption, Epoxy resins, High temperature, Temperature, Thermal expansion
Journal Articles

Numerical Study on the Local Aggregation of Helium Bubbles in Liquid Lithium and Its Thermal Analysis

Yongfu Liu, Yi He, Peng Tan
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 081005.
Paper No: TSEA-23-1508
https://doi.org/10.1115/1.4065467
Published Online: May 23, 2024
View Article titled, Numerical Study on the Local Aggregation of Helium Bubbles in Liquid Lithium and Its Thermal Analysis
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Topics: Bubbles, Helium, Lithium, Thermal analysis
Journal Articles

Numerical Investigation of the Heat Transfer Characteristics of Liquid Lithium Metal in Spiral Tubes

Yongfu Liu, Yi He, Peng Tan
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2023, 15(12): 121012.
Paper No: TSEA-23-1176
https://doi.org/10.1115/1.4063570
Published Online: October 20, 2023
View Article titled, Numerical Investigation of the Heat Transfer Characteristics of Liquid Lithium Metal in Spiral Tubes
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Topics: Flow (Dynamics), Geometry, Heat transfer, Lithium, Pipes, Prandtl number, Pressure, Pressure drop, Turbulence, Heat exchangers
Journal Articles

Numerical Investigation on the Heat Transfer Characteristics of Liquid Lithium Metal in a Bent Tube and Its Structure Optimization

Yongfu Liu, Yi He, Peng Tan
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. November 2022, 14(11): 111011.
Paper No: TSEA-22-1070
https://doi.org/10.1115/1.4054627
Published Online: July 18, 2022
View Article titled, Numerical Investigation on the Heat Transfer Characteristics of Liquid Lithium Metal in a Bent Tube and Its Structure Optimization
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Topics: Density, Entropy, Flow (Dynamics), Heat, Heat transfer, Lithium, Optimization, Pipes, Prandtl number, Pressure
Proceedings Papers

Experimental Study on the Effect of Surface Integrity on Fatigue Performance of Aero-Engine Blades

Yun Huang, Shaochuan Li, Guijian Xiao, Benqiang Chen, Yi He, Wenxi Wang, Kun Zhou
Proc. ASME. MSEC2021, Volume 2: Manufacturing Processes; Manufacturing Systems; Nano/Micro/Meso Manufacturing; Quality and Reliability, V002T06A027, June 21–25, 2021
Publisher: American Society of Mechanical Engineers
Paper No: MSEC2021-63712
https://doi.org/10.1115/MSEC2021-63712
View Paper titled, Experimental Study on the Effect of Surface Integrity on Fatigue Performance of Aero-Engine Blades
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Topics: Aircraft engines, Belts, Blades, Fatigue, Fatigue testing, Grinding, Vibration
Journal Articles

Mechanical Characterization of Thermal Interface Materials and Its Challenges

Vijay Subramanian, Jorge Sanchez, Joseph Bautista, Yi He, Jinlin Wang, Abhishek Das, Jesus Gerardo Reyes Schuldes, Kyle Yazzie, Hemanth K. Dhavaleswarapu, Pramod Malatkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2019, 141(1): 010804.
Paper No: EP-18-1086
https://doi.org/10.1115/1.4042805
Published Online: March 13, 2019
View Article titled, Mechanical Characterization of Thermal Interface Materials and Its Challenges
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Topics: Adhesion, Compression, Shear (Mechanics), Temperature, Thermal expansion, Stress, Thermomechanics, Silicon
Journal Articles

Effects of Control Valve's Structure Parameters on the Circulation Characteristics for an Electronic Unit Pump

Wan-Lin Zhao, Guo-Xiu Li, Lan Wang, Hong-Meng Li, Jie Wang, Shuang-Yi He
Journal: Journal of Engineering for Gas Turbines and Power
Publisher: ASME
Article Type: Research-Article
J. Eng. Gas Turbines Power. February 2019, 141(2): 021014.
Paper No: GTP-16-1189
https://doi.org/10.1115/1.4041386
Published Online: October 4, 2018
View Article titled, Effects of Control Valve's Structure Parameters on the Circulation Characteristics for an Electronic Unit Pump
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Topics: Cavitation, Flow (Dynamics), Valves, Pumps, Fuels
eBook Chapter

The Advantages and Mechanism of Semi-Aerobic Landfill

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2012
https://doi.org/10.1115/1.859971.paper67
ISBN: 9780791859971
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Topics: Sanitary landfills
eBook Chapter

Analysis of Competition among Internet Companies: The Case of 3Q

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
https://doi.org/10.1115/1.859759.paper123
ISBN: 9780791859759
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Topics: Internet
Proceedings Papers

Modeling Optical Properties of Small Metallic Nanoparticles Based on Density Functional Theory

Yi He, Taofang Zeng
Proc. ASME. HT2007, ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference, Volume 1, 933-935, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: HT2007-32843
https://doi.org/10.1115/HT2007-32843
View Paper titled, Modeling Optical Properties of Small Metallic Nanoparticles Based on Density Functional Theory
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Topics: Density functional theory, Modeling, Nanoparticles, Silver, Atoms, Density, Electric fields, Electron configuration, Electrons, Tight-binding model
Proceedings Papers

Thermal and Physical Characterization and Curing Kinetics Study of a Novel Curable Fillet Forming Ball Attach Flux for Improvement of Solder Joint Reliability on Ball Grid Array Packages

Dennis Prem Kumar Chandran, Yi He, Eng Chiang Gan
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 109-114, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35038
https://doi.org/10.1115/IPACK2003-35038
View Paper titled, Thermal and Physical Characterization and Curing Kinetics Study of a Novel Curable Fillet Forming Ball Attach Flux for Improvement of Solder Joint Reliability on Ball Grid Array Packages
Open the PDF for Thermal and Physical Characterization and Curing Kinetics Study of a Novel Curable Fillet Forming Ball Attach Flux for Improvement of Solder Joint Reliability on Ball Grid Array Packages in another window
Topics: Ball-Grid-Array packages, Hardening (Curing), Reliability, Solder joints, Polymers, Robustness, Thermal properties