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Proceedings Papers

Mechanism Research of Coupling Drag Reduction and Heat Transfer on Surface With Different Liquid-Solid Interaction

Lin Shi, Chengzhi Hu, Minli Bai, Jizu Lv, Yubai Li
Proc. ASME. MNHMT2019, ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T03A006, July 8–10, 2019
Paper No: MNHMT2019-4180
DOI: https://doi.org/10.1115/MNHMT2019-4180
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Topics: Drag reduction, Heat transfer, Molecular dynamics simulation
Proceedings Papers

Molecular Dynamics Simulation of Boiling Behavior of Nanofluid With Various Wettability Nanoparticle on Hydrophobic Surface

Xunyan Yin, Minli Bai, Chengzhi Hu, Jizu Lv, Yubai Li
Proc. ASME. MNHMT2019, ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T04A008, July 8–10, 2019
Paper No: MNHMT2019-4164
DOI: https://doi.org/10.1115/MNHMT2019-4164
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Topics: Boiling, Molecular dynamics simulation, Nanofluids, Nanoparticles
Proceedings Papers

Numerical Study on the Mechanism of Heat Transfer Enhancement in Fe 3 O 4 Nanoferrofluids With Magnetic Field

Chenfei Wang, Dongdong Gao, Minli Bai, Peng Wang, Yubai Li
Proc. ASME. MNHMT2019, ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T02A005, July 8–10, 2019
Paper No: MNHMT2019-4198
DOI: https://doi.org/10.1115/MNHMT2019-4198
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Topics: Heat transfer, Magnetic fields, Nanofluids
Proceedings Papers

Experiment of Enhanced Pool Boiling Heat Transfer on Coupling Effects of Nano-Structure and Synergistic Micro-Channel

Linsong Gao, Jizu Lv, Minli Bai, Chengzhi Hu, Liqun Du, Yubai Li
Proc. ASME. MNHMT2019, ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T04A010, July 8–10, 2019
Paper No: MNHMT2019-4215
DOI: https://doi.org/10.1115/MNHMT2019-4215
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Topics: Heat transfer, Microchannels, Nanostructures , Nickel, Pool boiling
Journal Articles

Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution

Jun Jie Liu, Hua Zhang, S. C. Yao, Yubai Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021008.
Paper No: EP-13-1129
DOI: https://doi.org/10.1115/1.4027420
Published Online: April 29, 2014
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Topics: Boiling, Cooling, Flow (Dynamics), Heat flux, Heat transfer, Microchannels, Modeling, Porous materials, Pressure drop, Temperature
Journal Articles

Thermal-Aware Microchannel Cooling of Multicore Processors: A Three-Stage Design Approach

Yubai Li, Dongzhi Guo, Shi-Chune Yao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021002.
Paper No: EP-13-1053
DOI: https://doi.org/10.1115/1.4027174
Published Online: April 29, 2014
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Topics: Cooling, Design, Microchannels, Cooling systems
Proceedings Papers

Thermal-Aware Micro-Channel Cooling of Multicore Processors: A Three-Stage Design Approach

Yubai Li, Dongzhi Guo, Shi-Chune Yao
Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A022, November 15–21, 2013
Paper No: IMECE2013-63265
DOI: https://doi.org/10.1115/IMECE2013-63265
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Topics: Cooling, Design, Microchannels, Cooling systems, Temperature, Pressure drop, Energy dissipation, Flow (Dynamics), Fluids, Heat
Proceedings Papers

Porous Media Modeling of Two-Phase Micro-Channel Cooling of Electronic Chips With Non-Uniform Power Distribution

Hua Zhang, Jun Jie Liu, Yubai Li, S. C. Yao
Proc. ASME. IMECE2013, Volume 8B: Heat Transfer and Thermal Engineering, V08BT09A071, November 15–21, 2013
Paper No: IMECE2013-64481
DOI: https://doi.org/10.1115/IMECE2013-64481
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Topics: Cooling, Microchannels, Modeling, Porous materials, Flow (Dynamics), Temperature, Computation, Heat, Stress, Boiling
Proceedings Papers

Strip-and-Zone Micro-Channel Liquid Cooling of Integrated Circuits Chips With Non-Uniform Power Distributions

Yu Zhang, Yubai Li, Xin Li, Shi-Chune Yao
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A007, July 14–19, 2013
Paper No: HT2013-17311
DOI: https://doi.org/10.1115/HT2013-17311
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Topics: Cooling, Integrated circuits, Microchannels, Strips, Design, Flow (Dynamics), Temperature, Heat flux, Heat transfer coefficients, Optimization
Proceedings Papers

Porous Media Thermal Modeling of an Electronic Chip With Non-Uniform Power Distribution and Cooled by Micro-Channels

Yubai Li, Yu Zhang, Shi-Chune Yao
Proc. ASME. HT2013, Volume 3: Gas Turbine Heat Transfer; Transport Phenomena in Materials Processing and Manufacturing; Heat Transfer in Electronic Equipment; Symposium in Honor of Professor Richard Goldstein; Symposium in Honor of Prof. Spalding; Symposium in Honor of Prof. Arthur E. Bergles, V003T10A005, July 14–19, 2013
Paper No: HT2013-17184
DOI: https://doi.org/10.1115/HT2013-17184
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Topics: Microchannels, Modeling, Porous materials, Heat flux, Computational fluid dynamics, Heat transfer coefficients, Simulation, Temperature, Computation, Convection
eBook Chapter

Comparation and Analysize of Three Nonlinear Kalman Filter

Series: ASME Press Select Proceedings
Publisher: ASME Press
Published: 2011
ISBN: 9780791859902
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Topics: Kalman filters