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Proceedings Papers

Thermal Lagging in Amorphous Materials

Da Yu Tzou, Yunsheng Xu

Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 107-113, November 17–22, 1996

Publisher: American Society of Mechanical Engineers

Paper No: IMECE1996-1343

https://doi.org/10.1115/IMECE1996-1343

View Paper titled, Thermal Lagging in Amorphous Materials

Topics: Amorphous materials, Diffusion (Physics), Fractals, Dimensions, Heat, Vibration

Journal Articles

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 188–191.

https://doi.org/10.1115/1.1477191

Published Online: July 26, 2002

View Article titled, Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Topics: Boron, Contact resistance, Lithium, Particulate matter, Ions, Sodium, Silicones, Solders, Thermal conductivity, Water

Journal Articles

Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]

Yunsheng Xu,, Xiangcheng Luo, and, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. June 2001, 123(2): 159.

https://doi.org/10.1115/1.1371771

Published Online: June 1, 2001

View Article titled, Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]

Topics: Electrons, Interface phenomena, Sodium, Sodium compounds, Thermal conductivity

Journal Articles

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Xiangcheng Luo,, Yunsheng Xu, and, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. September 2001, 123(3): 309–311.

https://doi.org/10.1115/1.1371925

Published Online: June 26, 2000

View Article titled, Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Topics: Contact resistance, Copper, Cycles, Disks, Electrical conductance, Heating, Silicones, Sodium, Thermal conductivity, Thermal stability

Journal Articles

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Yunsheng Xu, Xiangcheng Luo, D. D. L. Chung

Publisher: ASME

J. Electron. Packag. June 2000, 122(2): 128–131.

https://doi.org/10.1115/1.483144

Published Online: December 28, 1999

View Article titled, Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Topics: Contact resistance, Particulate matter, Silicones, Sodium, Thermal conductivity, Boron, Water, Copper, Fillers (Materials), Solders

Journal Articles

Analysis of Thermal Injury Process Based on Enzyme Deactivation Mechanisms

Yunsheng Xu, Renzhang Qian

Publisher: ASME

J Biomech Eng. November 1995, 117(4): 462–465.

https://doi.org/10.1115/1.2794208

Published Online: November 1, 1995

View Article titled, Analysis of Thermal Injury Process Based on Enzyme Deactivation Mechanisms

Topics: Enzymes, Wounds, Damage, Biological tissues, Proteins, Temperature

Journal citation

NARROW

Thermal Lagging in Amorphous Materials

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Analysis of Thermal Injury Process Based on Enzyme Deactivation Mechanisms

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

Thermal Lagging in Amorphous Materials

Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance

Erratum: “Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductances” [ASME J. Electron. Packag., 122 , No. 2, pp. 128–131]

Thermal Stability of Thermal Interface Pastes, Evaluated by Thermal Contact Conductance Measurement

Sodium Silicate Based Thermal Interface Material for High Thermal Contact Conductance

Analysis of Thermal Injury Process Based on Enzyme Deactivation Mechanisms

ASME Journals

ASME Conference Proceedings

ASME eBooks

Resources

Opportunities

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