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Journal Articles

Experimental Study on Interface Thermal Resistance of Heat Dissipation Channel in Low-Temperature Detector

Shijun Li, Shaojun Wu, Shimeng Lv, Teng Xie
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Technical Briefs
J. Thermal Sci. Eng. Appl. August 2024, 16(8): 084501.
Paper No: TSEA-23-1601
https://doi.org/10.1115/1.4065493
Published Online: May 23, 2024
View Article titled, Experimental Study on Interface Thermal Resistance of Heat Dissipation Channel in Low-Temperature Detector
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Topics: Energy dissipation, Heat, Low temperature, Sensors, Temperature, Thermal resistance, Fillers (Materials), Simulation, Thermal conductivity
Journal Articles

The Antifouling Effects of Copper-Oxide Filler Incorporated Into Paint-Based Protective Films Applied to Steam Surface Condenser Tubes

H. C. R Reuter, M. Owen, J. L. Goodenough
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. August 2018, 10(4): 041015.
Paper No: TSEA-17-1148
https://doi.org/10.1115/1.4039354
Published Online: May 8, 2018
View Article titled, The Antifouling Effects of Copper-Oxide Filler Incorporated Into Paint-Based Protective Films Applied to Steam Surface Condenser Tubes
Open the PDF for The Antifouling Effects of Copper-Oxide Filler Incorporated Into Paint-Based Protective Films Applied to Steam Surface Condenser Tubes in another window
Topics: Annulus, Biofouling, Condensers (steam plant), Convection, Cooling, Copper, Epoxy adhesives, Epoxy resins, Fillers (Materials), Flow (Dynamics)
Journal Articles

Thermal Conductivity and Mechanical Properties of Low-Density Silicone Rubber Filled With Al 2 O 3 and Graphene Nanoplatelets

Yingchun Zhang, Wei Yu, Liye Zhang, Junshan Yin, Jingkang Wang, Huaqing Xie
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. February 2018, 10(1): 011014.
Paper No: TSEA-17-1003
https://doi.org/10.1115/1.4036797
Published Online: August 28, 2017
View Article titled, Thermal Conductivity and Mechanical Properties of Low-Density Silicone Rubber Filled With Al 2 O 3 and Graphene Nanoplatelets
Open the PDF for Thermal Conductivity and Mechanical Properties of Low-Density Silicone Rubber Filled With Al 2 O 3 and Graphene Nanoplatelets in another window
Topics: Composite materials, Density, Fillers (Materials), Graphene, Silicone rubber, Thermal conductivity, Tensile strength, Heat
Journal Articles

Mechanical and Heat Transfer Performance Investigation of High Thermal Conductivity, Commercially Available Polymer Composite Materials for Heat Exchange in Electronic Systems

Peter Rodgers, Valerie Eveloy, Antoine Diana, Ismail Darawsheh, Fahad Almaskari
Journal: Journal of Thermal Science and Engineering Applications
Publisher: ASME
Article Type: Research-Article
J. Thermal Sci. Eng. Appl. September 2017, 9(3): 031008.
Paper No: TSEA-16-1170
https://doi.org/10.1115/1.4035942
Published Online: April 4, 2017
View Article titled, Mechanical and Heat Transfer Performance Investigation of High Thermal Conductivity, Commercially Available Polymer Composite Materials for Heat Exchange in Electronic Systems
Open the PDF for Mechanical and Heat Transfer Performance Investigation of High Thermal Conductivity, Commercially Available Polymer Composite Materials for Heat Exchange in Electronic Systems in another window
Topics: Composite materials, Heat exchangers, Heat transfer, Mechanical properties, Polymer composites, Thermal conductivity, Tensile strength, Impact strength, Polymers, Fillers (Materials)