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Keywords: architecture
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2010, 2(4): 041001.
Published Online: January 6, 2011
... thermal solution given their simplicity, performance, and the development of MHS-compatible 3D device architecture. As the traditional methods of cooling generally have uniform heat removal on the contact area with the device, thermal consequences of design have traditionally been considered only after...